Masking jig, substrate heating device, and coating method

• US 8,414,977 B2
• Filed: 05/10/2010
• Issued: 04/09/2013
• Est. Priority Date: 05/10/2010
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Ikejiri, Takashi
• Primary Examiner(s): PARKER, FREDERICK JOHN
• Application Number:
  US13/133,271
• Publication Number:
  US 20120148738A1
• Time in Patent Office: 1,065 Days
• Field of Search: 427/282, 427/468, 118/504, 118/505
• US Class Current: 427/282
• CPC Class Codes: B05B 12/28 for defining uncoated areas that are not enclosed within coated areas or vice versa, e.g. for defining U-shaped border lines
• CPC Class Codes: B05B 7/1486 for spraying particulate material in dry state
• CPC Class Codes: C23C 24/04 Impact or kinetic deposition of particles
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A masking jig for specifying a coating region on which a coating is formed by spraying copper powder onto a front surface of an insulating substrate from a cold spray device. This masking jig includes a metal member formed with an opening for specifying the coating region and placed in contact with the front surface of the insulating substrate. The metal member internally includes a heating wire is provided to heat the vicinity of the opening. A cooler is connected to a back surface of the insulating substrate.

Claims

1. A coating method for forming a coating on a front surface of a substrate including a back surface connected to a radiator and constituting a power module by spraying material powder in solid state from a spray device onto the front surface of the substrate, the method comprising the steps of:

placing a masking jig in contact with the front surface of the substrate, the masking jig being formed with an opening for specifying a coating region in which the coating is to be formed, the masking jig internally including a heat generating device to heat the vicinity of the opening;

causing the heat generating device to heat the vicinity of the opening; and

causing the spray device to spray the material powder onto the front surface of the heated substrate.

2. The coating method according to claim 1, wherein

the masking jig is formed with a plurality of the openings in correspondence with a plurality of the substrates connected to the single radiator, and

the heat generating device heats the vicinity of each opening.

3. A masking jig for specifying a coating region on a front surface of a substrate including a back surface connected to a radiator and constituting a power module, when a coating is to be formed in the coating region by spraying material powder in solid state from a spray device onto the surface, the masking jig comprising:

a contact member formed with an opening to specify the coating region, the contact member being to be placed in contact with the front surface of the substrate, and the contact member internally including a heat generating device for heating the vicinity of the opening, wherein

the contact member is formed with a plurality of the openings in correspondence with a plurality of the substrates connected to the single radiator, and

the heat generating device is located to heat the vicinity of each opening.

4. The masking jig according to claim 3, wherein

an insulating member for restraining heat transfer is placed over the contact member in a direction of thickness of the substrate.

5. The masking jig according to claim 3, wherein

the contact member includes a planar portion formed with the opening and a side portion extending from the planar portion in the thickness direction of the substrate and surrounding the substrate, and

the heat generating device is placed in the planar portion and the side portion.

6. The masking jig according to claim 4, wherein

the contact member includes a planar portion formed with the opening and a side portion extending from the planar portion in the thickness direction of the substrate and surrounding the substrate, and

the heat generating device is placed in the planar portion and the side portion.

7. A substrate heating device for heating a substrate including a back surface connected to a radiator and constituting a power module when a coating is to be formed on a front surface of the substrate by spraying material powder in solid state from a spray device onto the surface, the heating device comprising:

a masking jig includes a contact member formed with an opening for specify a coating region in which the coating is to be formed, the contact member being placed in contact with the front surface of the substrate, and a heating wire placed internally in the contact member to heat the vicinity of the opening;

a power source for supplying current to the heating wire; and

a control device for controlling the power source, wherein

the contact member is formed with a plurality of the openings in correspondence with a plurality of the substrates connected to the single radiator, and

the heat generating device is located to heat the vicinity of each opening.