Patterned inorganic layers, radiation based patterning compositions and corresponding methods

• US 8,415,000 B2
• Filed: 10/28/2011
• Issued: 04/09/2013
• Est. Priority Date: 06/01/2010
• Status: Active Grant

• Current Assignee: Inpria Corporation
• Original Assignee: Inpria Corporation
• Inventors: Stowers, Jason K., Telecky, Alan J., Keszler, Douglas A., Grenville, Andrew
• Primary Examiner(s): Sample, David
• Assistant Examiner(s): Gugliotta, Nicole T
• Application Number:
  US13/284,531
• Publication Number:
  US 20120070613A1
• Time in Patent Office: 529 Days
• Field of Search: None
• US Class Current: 428/141
• CPC Class Codes: G03F 7/0042 with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists G03F7/075 takes precedence
• CPC Class Codes: G03F 7/0043 Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof G03F7/0044 takes precedence
• CPC Class Codes: G03F 7/20 Exposure; Apparatus therefor photographic printing apparatus for making copies G03B27/00
• CPC Class Codes: G03F 7/327 Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Abstract

Stabilized precursor solutions can be used to form radiation inorganic coating materials. The precursor solutions generally comprise metal suboxide cations, peroxide-based ligands and polyatomic anions. Design of the precursor solutions can be performed to achieve a high level of stability of the precursor solutions. The resulting coating materials can be designed for patterning with a selected radiation, such as ultraviolet light, x-ray radiation or electron beam radiation. The radiation patterned coating material can have a high contrast with respect to material properties, such that development of a latent image can be successful to form lines with very low line-width roughness and adjacent structures with a very small pitch.

Claims

1. A patterned structure comprising a substrate and a patterned inorganic material on a surface of the substrate, wherein the patterned inorganic material has edges with an average line-width roughness no more than about 2.25 nm for features with an average pitch of no more than about 60 nm or with an average line-width roughness from about 1.2 nm to about 1.6 nm for individual features having an average width of no more than about 30 nm.

2. The patterned structure of claim 1 wherein the patterned inorganic material comprises a Hf, Zr or combinations thereof.

3. The patterned structure of claim 1 wherein the patterned inorganic material comprises a patterned semiconductor material or a patterned dielectric material.

4. The patterned structure of claim 1 wherein the average line-width roughness is from about 1.2 nm to about 1.6 nm.

5. A method for forming the patterned structure of claim 1, the method comprising:

irradiating a layer of coating material with extreme ultraviolet light at a dose of no more than about 100 mJ/cm² or with an electron beam at a dose equivalent to no more than about 300 μ

C/cm² at 30 kV; and

contacting the irradiated layer with a developing composition to dissolve un-irradiated material to form the patterned inorganic material.

6. The patterned structure of claim 1 wherein the patterned inorganic material has an average pitch of no more than about 40 nm.

7. The patterned structure of claim 1 wherein the individual features of the patterned inorganic material has an average width of no more than about 20 nm.

8. The patterned structure of claim 1 wherein the patterned inorganic material comprises Cu, Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, Ir, Pt, La, Ce, Pr, Nb, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu or a combination thereof.

9. The patterned structure of claim 1 wherein the patterned inorganic material comprises silicon.

10. The patterned structure of claim 1 wherein the substrate is a silicon wafer.

11. The patterned structure of claim 1 wherein the edges are edges of lines having a pitch of no more than about 60 nm and an average width of no more than about 30 nm.

12. The patterned structure of claim 1 wherein the edges are edges of contact holes having a pitch of no more than about 60 nm and an average width of no more than about 30 nm.

13. The patterned structure of claim 1 wherein the patterned inorganic material comprises sulfur.

14. The patterned structure of claim 1 wherein the patterned inorganic material comprises B, As, Mo, P, W, Se, Si or combinations thereof.

15. The patterned structure of claim 1 wherein the average line-width roughness is no more than about 1.8 nm for features with an average pitch of no more than about 60 nm.

16. The patterned structure of claim 1 wherein the average line-width roughness is from about 1.2 nm to about 2.0 nm for features with an average pitch of no more than about 60 nm.

17. The patterned structure of claim 1 wherein the average line-width roughness is no more than about 1.8 nm for features with an average pitch of no more than about 40 nm.