Method for transferring functional regions, LED array, LED printer head, and LED printer

• US 8,415,230 B2
• Filed: 03/01/2010
• Issued: 04/09/2013
• Est. Priority Date: 03/04/2009
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Yonehara, Takao, Takai, Yasuyoshi
• Primary Examiner(s): Garber, Charles
• Assistant Examiner(s): MUSTAPHA, ABDULFATTAH B
• Application Number:
  US13/254,024
• Publication Number:
  US 20110311276A1
• Time in Patent Office: 1,135 Days
• Field of Search: 438 26- 34, 438/47, 438/238, 438/455, 438/458, 257/79, 257/277, 257/618, 257/E21.22, 257/E21.211, 257/E21.122, 257/E23.141, 257/E27.121
• US Class Current: 438/458
• CPC Class Codes: B41J 2/45 using light-emitting diode [LED] or laser arrays
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate

Abstract

Provided is a method for transferring, onto a second substrate, at least one of functional regions arranged and joined to a first separation layer that is disposed on a first substrate and that becomes separable by a treatment, in which regions on the second substrate where the functional regions are to be transferred have a second separation layer that becomes separable by a treatment. The method includes a step of joining the first substrate to the second substrate by bonding such that the functional regions contact the second separation layer; a step of separating the functional regions from the first substrate at the first separation layer; and a step of, before or after the step of separation, forming separation grooves penetrating through the second substrate and the second separation layer from a surface of the second substrate, the surface being opposite to a surface having the second separation layer thereon.

Claims

1. A method for transferring a functional region from a first substrate to a second substrate,

wherein a first separation layer which becomes separable by a treatment is disposed between the first substrate and the functional region, and a second separation layer that becomes separable by a treatment is disposed in a region on the second substrate where the functional region is to be transferred, and

wherein a plurality of groups, each of which includes a plurality of functional regions, are formed on the first substrate and a plurality of segments, each of which corresponds to the respective group, are formed on the second substrate, the method comprising:

a first step of joining the first substrate to the second substrate by bonding such that the functional regions are in contact with the second separation layer;

a second step of separating the functional regions from the first substrate at the first separation layer; and

a third step of, before or after the second step, forming separation grooves penetrating through the second substrate and the second separation layer from a surface of the second substrate, the surface being opposite to a surface having the second separation layer thereon, so that the separation grooves separate the second substrate into the plurality of segments after the second step.

2. The method according to claim 1,

wherein, in the third step, the separation grooves are formed in a state in which the first substrate is joined to the second substrate, and

in the second step, the functional regions are separated from the first substrate by at least removing the first separation layer with an etchant introduced through the separation grooves.

3. The method according to claim 1,

wherein a plurality of the functional regions are arranged on the first substrate with predetermined interval regions therebetween, and

the separation grooves provided through the second substrate are formed at positions corresponding to at least a part of the interval regions disposed between the functional regions.

4. The method according to claim 1,

wherein an alignment region is provided on the first separation layer of the first substrate, and

in the second step, when the functional regions are transferred from the first substrate onto the second substrate, the alignment region is also transferred onto the second substrate.

5. The method according to claim 1,

wherein an alignment region is provided on the first substrate, and

an alignment region corresponding to the alignment region on the first substrate is provided on the second substrate.

6. The method according to claim 1, wherein, in transferring the functional regions, a joining position is determined using, as an alignment region, at least one of the functional regions, a joining layer that joins the functional regions to a substrate, and the separation layers.

7. The method according to claim 1, wherein segments of the second substrate separated from each other by the separation grooves in the third step are reused as the second substrate after functional regions on the segments are transferred onto another substrate, the second separation layer is removed, and a new second separation layer is formed.

8. An LED array comprising:

LEDs including a light-emitting layer serving as functional regions; and

circuits that drive the LEDs and that are electrically connected to the functional regions,

the LED array being produced by transferring the functional regions by the method according to claim 1.

9. An LED printer head comprising:

the LED array according to claim 8; and

a rod lens array mounted on the LED array.

10. An LED printer comprising:

an LED printer head including the LED array according to claim 8 or the LED printer head according to claim 9;

a photosensitive member;

a charger; and

an imaging unit configured to write an electrostatic latent image on the photosensitive member using the LED printer head as a light source.

11. A color LED printer comprising:

LED printer heads each including the LED array according to claim 8 or the LED printer heads according to claim 9;

photosensitive members;

a charger; and

a plurality of imaging units each configured to write an electrostatic latent image on one of the photosensitive members using a corresponding LED printer head as a light source.