Semiconductor display device

• US 8,415,669 B2
• Filed: 08/25/2011
• Issued: 04/09/2013
• Est. Priority Date: 04/09/2002
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Murakami, Satoshi, Hayakawa, Masahiko, Kato, Kiyoshi, Osame, Mitsuaki
• Primary Examiner(s): Tran, Minh-Loan T
• Assistant Examiner(s): Erdem, Fazli
• Application Number:
  US13/217,322
• Publication Number:
  US 20110309364A1
• Time in Patent Office: 593 Days
• Field of Search: None
• US Class Current: 257/59
• CPC Class Codes: G02F 1/133357 Planarisation layers
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1244 for preventing breakage, peeling or short circuiting
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/123 Connection of the pixel electrodes to the thin film transistors [TFT]
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/873 Encapsulations

Abstract

It is an object of the present invention to provide a semiconductor display device having an interlayer insulating film which can obtain planarity of a surface while controlling film formation time, can control treatment time of heating treatment with an object of removing moisture, and can prevent moisture in the interlayer insulating film from being discharged to a film or an electrode adjacent to the interlayer insulating film. An inorganic insulating film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover a TFT. Next, an organic resin film containing photosensitive acrylic resin is applied to the organic insulating film, and the organic resin film is partially exposed to light to be opened. Thereafter, an inorganic insulating film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover the opened organic resin film. Then, in the opening part of the organic resin film, a gate insulating film and the two layer inorganic insulating film containing nitrogen are opened partially by etching to expose an active layer of the TFT.

Claims

1. A display device comprising:

a thin film transistor comprising a gate electrode;

a conductive layer comprising a same material as the gate electrode;

a first insulating film over the conductive layer;

an organic resin film over the first insulating film,

wherein the organic resin film has an opening,

wherein the opening is provided over the conductive layer; and

a second insulating film over the organic resin film,

wherein the second insulating film is in contact with the first insulating film in the opening.

2. The display device according to claim 1, wherein the thin film transistor is a top gate type.

3. The display device according to claim 1, wherein the gate electrode comprises an element selected from the group consisting of Ta, W, Ti, Mo, Al, Cu and Si.

4. The display device according to claim 1, wherein the first insulating film comprises silicon and nitrogen.

5. The display device according to claim 1, wherein the second insulating film comprises silicon and nitrogen.

6. The display device according to claim 1, wherein a section of an edge portion of the opening curves.

7. A display device comprising:

a thin film transistor comprising a gate electrode;

a first conductive layer comprising a same material as the gate electrode;

a first insulating film over the first conductive layer;

an organic resin film over the first insulating film,

wherein the organic resin film has a first opening,

wherein the first opening is provided over the first conductive layer;

a second insulating film over the organic resin film;

wherein the second insulating film is in contact with the first insulating film in the first opening, and

wherein the first insulating film and the second insulating have a second opening in the first opening, and

a second conductive layer over the second insulating film and in the second opening.

8. The display device according to claim 7, wherein the thin film transistor is a top gate type.

9. The display device according to claim 7, wherein the gate electrode comprises an element selected from the group consisting of Ta, W, Ti, Mo, Al, Cu and Si.

10. The display device according to claim 7, wherein the first insulating film comprises silicon and nitrogen.

11. The display device according to claim 7, wherein the second insulating film comprises silicon and nitrogen.

12. The display device according to claim 7, wherein a section of an edge portion of the first opening curves.

13. A display device comprising:

a semiconductor layer;

a gate electrode with a gate insulating film interposed between the semiconductor layer and the gate electrode;

a first insulating film over the semiconductor layer, the gate electrode and the gate insulating film, wherein the first insulating film has at least one first opening over the semiconductor layer;

a wiring over the first insulating film, wherein the wiring is electrically connected to the semiconductor layer through the first opening;

an organic resin film over the wiring, wherein the organic resin film has a second opening over the wiring;

a second insulating film over the organic resin film, wherein the second insulating film has a third opening in the second opening; and

a conductive layer over the second insulating film and in the third opening, wherein the conductive layer is electrically connected to the wiring.

14. The display device according to claim 13, wherein the semiconductor layer comprises polysilicon.

15. The display device according to claim 13, wherein the gate electrode comprises an element selected from the group consisting of Ta, W, Ti, Mo, Al, Cu and Si.

16. The display device according to claim 13, wherein the wiring comprises an element selected from the group consisting of Al, Ti and W.

17. The display device according to claim 13, wherein the second insulating film comprises silicon and nitrogen.

18. The display device according to claim 13, wherein a section of an edge portion of the second opening curves.

19. A display device comprising:

a semiconductor layer;

a gate electrode with a gate insulating film interposed between the semiconductor layer and the gate electrode;

a first insulating film over the semiconductor layer, the gate electrode and the gate insulating film, wherein the first insulating film has at least one first opening over the semiconductor layer;

a second insulating film comprising silicon and nitrogen over the first insulating film, wherein the second insulating film has at least one second opening over the semiconductor layer;

a wiring over the second insulating film, wherein the wiring is electrically connected to the semiconductor layer through the second opening and the first opening;

an organic resin film over the wiring, wherein the organic resin film has a third opening over the wiring;

a third insulating film over the organic resin film, wherein the third insulating film has a fourth opening in the third opening; and

a conductive layer over the third insulating film and in the fourth opening, wherein the conductive layer is electrically connected to the wiring.

20. The display device according to claim 19, wherein the semiconductor layer comprises polysilicon.

21. The display device according to claim 19, wherein the gate electrode comprises an element selected from the group consisting of Ta, W, Ti, Mo, Al, Cu and Si.

22. The display device according to claim 19, wherein the wiring comprises an element selected from the group consisting of Al, Ti and W.

23. The display device according to claim 19, wherein the third insulating film comprises silicon and nitrogen.

24. The display device according to claim 19, wherein a section of an edge portion of the third opening curves.