Light emitting device with encapsulant formed with barriers and light emitting device package having the same
First Claim
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1. A light emitting device comprising:
- a light emitting diode chip;
a barrier on the light emitting diode chip; and
an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip,wherein the barrier includes four barriers separated from each other at an outer peripheral portion of the light emitting diode chip, andwherein at least one of the four barriers comprises a dummy pad, and at least one of four barriers comprises a pad, andwherein the dummy pad is not electrically connected to the pad.
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Abstract
Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.
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Citations
18 Claims
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1. A light emitting device comprising:
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a light emitting diode chip; a barrier on the light emitting diode chip; and an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip, wherein the barrier includes four barriers separated from each other at an outer peripheral portion of the light emitting diode chip, and wherein at least one of the four barriers comprises a dummy pad, and at least one of four barriers comprises a pad, and wherein the dummy pad is not electrically connected to the pad. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a light emitting device, the method comprising:
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forming a light emitting diode chip; forming a barrier on the light emitting diode chip; and forming an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip, wherein the barrier includes four barriers separated from each other at an outer peripheral portion of the light emitting diode chip, wherein at least one of the four barriers comprises a dummy pad, and at least one of four barriers comprises a pad, and wherein the dummy pad is not electrically connected to the pad. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A light emitting device package comprising:
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a sub-mount; a light emitting diode chip over the sub-mount; a barrier on the light emitting diode chip; and an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip, wherein the barrier includes four barriers separated from each other at an outer peripheral portion of the light emitting diode chip, and wherein at least one of the four barriers comprises a dummy pad, and at least one of four barriers comprises a pad, and wherein the dummy pad is not electrically connected to the pad. - View Dependent Claims (16, 17, 18)
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Specification