Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
First Claim
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive that includes an opening;
a heat spreader that includes a post, a base and a flange, wherein the post is adjacent to the base and the flange, extends above the base in an upward direction and extends below the flange in a downward direction opposite the upward direction, the base extends below the post and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the flange extends above the post and extends laterally beyond the post and a cavity in the flange is located above the post and faces in the upward direction; and
a conductive trace that includes a pad and a terminal;
wherein the semiconductor device extends into the cavity, is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends above the post and below the flange, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the flange;
wherein the conductive trace is located outside the cavity; and
wherein the post extends into the opening, the flange extends upwardly from the post in the opening and extends laterally above and overlaps the adhesive, the cavity extends into the opening and the base extends below the semiconductor device and the pad.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.
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Citations
35 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a flange, wherein the post is adjacent to the base and the flange, extends above the base in an upward direction and extends below the flange in a downward direction opposite the upward direction, the base extends below the post and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the flange extends above the post and extends laterally beyond the post and a cavity in the flange is located above the post and faces in the upward direction; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device extends into the cavity, is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends above the post and below the flange, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the flange; wherein the conductive trace is located outside the cavity; and wherein the post extends into the opening, the flange extends upwardly from the post in the opening and extends laterally above and overlaps the adhesive, the cavity extends into the opening and the base extends below the semiconductor device and the pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a flange, wherein the post is adjacent to the base and the flange, extends above the base in an upward direction and extends below the flange in a downward direction opposite the upward direction, the base extends below the post and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the flange extends above the post and extends laterally beyond the post and a cavity in the flange is located above the post and faces in the upward direction; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is located within the cavity, is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends above the post and below the flange, extends laterally from the post to or beyond the terminal and is sandwiched between the base and the flange, between the base and the dielectric layer and between the flange and the dielectric layer; wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity; wherein the conductive trace is located outside the cavity; and wherein the post extends into the opening, the flange extends upwardly from the post in the opening, extends laterally beyond the post outside the opening, extends into the aperture and extends laterally above and overlaps the adhesive and the dielectric layer, the cavity extends into the opening and the aperture and the base extends below the semiconductor device, the substrate and the pad. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A semiconductor chip assembly, comprising:
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a semiconductor device; an adhesive that includes an opening; a heat spreader that includes a post, a base and a flange, wherein the post is adjacent to the base and the flange, extends above the base in an upward direction and extends below the flange in a downward direction opposite the upward direction, the base extends below the post and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the flange extends above the post and extends laterally beyond the post and a cavity in the flange is located above the post and faces in the upward direction; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and a conductive trace that includes a pad and a terminal; wherein the semiconductor device is located within the cavity, is above and overlaps the post, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the post and thereby thermally connected to the base; wherein the adhesive is mounted on and extends above the base, covers and surrounds the post in the lateral directions, extends above the post and below the flange, extends laterally from the post to or beyond the terminal, extends to peripheral edges of the assembly and contacts and is sandwiched between the base and the flange, between the base and the dielectric layer and between the flange and the dielectric layer; wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity; wherein the conductive trace is located outside the cavity; and wherein the post extends into the opening, the flange extends upwardly from the post in and above the opening, extends laterally beyond the post outside the opening, extends into and above the aperture, extends laterally above and contacts and overlaps the adhesive and the dielectric layer and covers the adhesive in the aperture in the upward direction, the cavity extends into and above the opening and the aperture and does not overlap the adhesive and the dielectric layer and the base extends below the semiconductor device, the substrate, the adhesive and the pad. - View Dependent Claims (32, 33, 34, 35)
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Specification