Semiconductor light emitting device

• US 8,415,705 B2
• Filed: 06/15/2011
• Issued: 04/09/2013
• Est. Priority Date: 11/14/2008
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Jeong, Hwan Hee
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US13/161,172
• Publication Number:
  US 20110241065A1
• Time in Patent Office: 664 Days
• Field of Search: 257/99, 257/98, 257/100, 257/E33.06, 257/E33.059, 257/E33.062
• US Class Current: 257/99
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/10 with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; an electrode layer on the plurality of compound semiconductor layers; and a channel layer including protrusion and formed along a peripheral portion of an upper surface of the plurality of compound semiconductor layers.

Claims

1. A semiconductor light emitting device comprising:

a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer;

a channel layer on the light emitting structure, having protrusions;

an electrode layer on the light emitting structure and the channel layer; and

a conductive support member on the electrode layer,

wherein the channel layer is formed along the peripheral portion of an upper surface of the light emitting structure, and the electrode layer is formed at an inner side of the upper surface of the light emitting structure,

wherein the protrusions of the channel layer are formed at an under surface of the channel layer such that the protrusions protrude toward the light emitting structure,

wherein the first conductive semiconductor layer includes a roughness pattern on a lower surface,

wherein the electrode layer includes a protrusion directly contacted with the light emitting structure, and

wherein the protrusion of the electrode layer is protruded toward the light emitting structure.

2. The semiconductor light emitting device of claim 1, wherein the first conductive semiconductor layer includes one selected from the group consisting of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP.

3. The semiconductor light emitting device of claim 1, wherein the second conductive semiconductor layer includes one selected from the group consisting of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP and AlGaInP.

4. The semiconductor light emitting device of claim 1, wherein the light emitting structure includes color LED emitting blue light, green light or red light or a UV LED.

5. The semiconductor light emitting device of claim 4, wherein the light emitting structure emits red light.

6. The semiconductor light emitting device of claim 1, wherein the first conductive semiconductor layer is a P-type semiconductor layer and the second conductive semiconductor layer is an N-type semiconductor layer.

7. The semiconductor light emitting device of claim 1, wherein the protrusions of the channel layer are provided in a closed loop.

8. The semiconductor light emitting device of claim 1, wherein the protrusions of the channel layer have a single configuration, a double configuration or a multiple configuration.

9. The semiconductor light emitting device of claim 1, wherein the protrusions of the channel layer include a height of about 10 nm to about 300 nm.

10. The semiconductor light emitting device of claim 1, wherein the protrusions of the channel layer are spaced apart from an outer wall of the light emitting structure by a distance about 1 μ

m to about 5 μ

m.

11. The semiconductor light emitting device of claim 1, wherein the electrode layer is formed on the second conductive semiconductor layer and the channel layer.

12. The semiconductor light emitting device of claim 1, wherein the second conductive semiconductor layer and the electrode layer include a plurality of patterns therebetween.

13. The semiconductor light emitting device of claim 1, wherein the conductive support member includes at least one selected from the group consisting of Cu, Au, Ni, Mo, Cu—

W, Si, Ge, GaAs, ZnO, SiC, SiGe and GaN.

14. The semiconductor light emitting device of claim 1, wherein the electrode layer comprises at least one of a reflective electrode layer, an ohmic-contact layer and an adhesion layer.

15. The semiconductor light emitting device of claim 14, wherein the reflective electrode layer includes at least one selected from the group consisting of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and the combination thereof.

16. A semiconductor light emitting device comprising:

a light emitting structure including an n-type conductive semiconductor layer, an active layer and a p-type conductive semiconductor layer;

a channel layer on the light emitting structure, having protrusions;

an electrode layer on the light emitting structure and the channel layer; and

a conductive support member on the electrode layer,

wherein the channel layer is formed along the peripheral portion of an upper surface of the light emitting structure,

wherein the electrode layer is formed on the upper surface of the light emitting structure,

wherein a part of the channel layer is extended outward from a side surface of the light emitting structure,

wherein the protrusions of the channel layer are protruded into the light emitting structure,

wherein the first conductive semiconductor layer includes a roughness pattern on a lower surface,

wherein the electrode layer includes a protrusion directly contacted with the light emitting structure, and

wherein the protrusion of the electrode layer is protruded toward the light emitting structure.

17. The semiconductor light emitting device of claim 16, wherein the p-type conductive semiconductor layer is disposed on the n-type conductive semiconductor layer and the active layer is disposed between the p-type conductive semiconductor layer and the n-type conductive semiconductor layer, and

wherein the protrusions of the channel layer are protruded up to a portion between the active layer and the p-type conductive semiconductor layer.

18. The semiconductor light emitting device of claim 16, wherein the protrusions of the channel layer are spaced apart from an outer wall of the light emitting structure by a distance of about 1 μ

m to about 5 μ

m.

19. The semiconductor light emitting device of claim 17, wherein the electrode layer comprises a reflective electrode layer and an adhesion layer.