Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device

• US 8,416,038 B2
• Filed: 04/13/2004
• Issued: 04/09/2013
• Est. Priority Date: 04/16/2003
• Status: Active Grant

• Current Assignee: Intellectual Ventures Holding 81 LLC (Intellectual Ventures LLC)
• Original Assignee: Intellectual Ventures Funding LLC (Intellectual Ventures LLC)
• Inventors: Anasako, Kenichi
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US10/822,731
• Publication Number:
  US 20050225410A1
• Time in Patent Office: 3,283 Days
• Field of Search: 333150-152, 333193-196, 310/313.B, 310/313.C, 310/313.D
• US Class Current: 333/193
• CPC Class Codes: H03H 9/0004 Impedance-matching networks H03H9/145 takes precedence
• CPC Class Codes: H03H 9/0296 Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/52 Electric coupling means
• CPC Class Codes: H03H 9/64 using surface acoustic waves
• CPC Class Codes: H03H 9/6489 Compensation of undesirable effects

Abstract

A surface acoustic wave device comprises a piezoelectric substrate (1), at least one inter-digital transducers (IDT) (2) provided on the piezoelectric substrate, at least one elongated electrode pad (4) electrically connected to the IDT, and at least one stud bump (5) disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.

Claims

1. A device, comprising:

at least one electrode pad electrically connected to at least one inter-digital transducer attached to a piezoelectric substrate; and

at least one stud bump disposed on the at least one electrode pad, wherein a position of the at least one stud bump on the at least one electrode pad causes a product of an inductance and a capacitance of the device to have a predetermined value, and

wherein the at least one electrode pad has a first wiring pattern and a second wiring pattern connected together at a common end, and the at least one stud bump is disposed on the at least one electrode pad to electrically short-circuit the first wiring pattern and the second wiring pattern.

2. The device according to claim 1, wherein the at least one electrode pad is elongated.

3. The device according to claim 1, wherein the at least one electrode pad has a plurality of wiring patterns including the first wiring pattern and the second wiring pattern, wherein at least one pair of adjacent wiring patterns, of the plurality of wiring patterns, are connected together and the at least one stud bump electrically short-circuits the at least one pair of adjacent wiring patterns.

4. The device according to claim 1, further comprising a base substrate having a third wiring pattern corresponding to the at least one electrode pad, wherein the at least one stud bump is electrically connected to the third wiring pattern.

5. The device of claim 1, further comprising at least one reflector configured to reflect a surface acoustic wave generated by the at least one inter-digital transducer.

6. A method, comprising:

determining a position, on at least one electrode pad having a first wiring pattern and a second wiring pattern connected together at a common end, at which placement of at least one stud bump causes a function of an inductance and a capacitance of a surface acoustic wave device to have a predetermined value; and

disposing the at least one stud bump at the position on the at least one electrode pad, wherein the disposing electrically short-circuits the first wiring pattern and the second wiring pattern.

7. The method according to claim 6, further comprising forming the at least one electrode pad to be elongated.

8. The method according to claim 6, further comprising forming the at least one electrode pad to have a plurality of wiring patterns including the first wiring pattern and the second wiring pattern, wherein at least one pair of adjacent wiring patterns, of the plurality of wiring patterns, are connected together and the at least one stud bump electrically short-circuits the at least one pair of adjacent wiring patterns.

9. The method according to claim 6, further comprising mounting the surface acoustic wave device having the at least one stud bump and the at least one electrode pad onto a base substrate having a third wiring pattern corresponding to the at least one electrode pad.

10. The method of claim 6, further comprising:

determining a size of the at least one electrode pad that, in combination with the position of the at least one stud bump on the at least one electrode pad, causes the function of the inductance and the capacitance of the surface acoustic wave device to have the predetermined value; and

sizing the at least one electrode pad based on the size.

11. The method of claim 6, further comprising generating a surface acoustic wave using an inter-digital transducer electrically connected to the at least one electrode pad.

12. The method of claim 11, further comprising reflecting the surface acoustic wave using at least one reflector disposed on at least one side of the inter-digital transducer.

13. An apparatus, comprising:

means for converting between a surface acoustic wave and an electrical signal, wherein the means for converting is connected to at least one electrode pad having a first wiring pattern and a second wiring pattern connected together at a common end; and

means for positioning at least one stud bump on the electrode pad,

wherein a position of the at least one stud bump on the at least one electrode pad causes a value based on an inductance and a capacitance of the apparatus to converge on a predetermined value, and

wherein the at least one stud bump electrically short-circuits the first wiring pattern and the second wiring pattern.

14. The apparatus of claim 13, further comprising means for reflecting the surface acoustic wave.