Cooling apparatus having low profile extrusion and method of manufacture therefor

• US 8,418,478 B2
• Filed: 08/30/2010
• Issued: 04/16/2013
• Est. Priority Date: 06/08/1998
• Status: Expired due to Fees

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Parish, Overton L. IV, DeVilbiss, Roger S.
• Primary Examiner(s): ALI, MOHAMMAD M
• Application Number:
  US12/871,583
• Publication Number:
  US 20110209856A1
• Time in Patent Office: 960 Days
• Field of Search: 62/37, 62/32, 62/33, 622/592, 165/104.33, 165/104.21, 165/104.19, 165/80.3
• US Class Current: 62/3.7
• CPC Class Codes: F28D 1/0246 heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 1/022 with multiple channels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/49377 Tube with heat transfer means
• CPC Class Codes: Y10T 29/49378 Finned tube
• CPC Class Codes: Y10T 29/49385 Made from unitary workpiece, i.e., no assembly
• CPC Class Codes: Y10T 29/49396 Condenser, evaporator or vaporizer making

Abstract

A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member. Cooling of the heat transfer fluid within the condenser section is enhanced by the second plurality of low profile extrusion members. The heat transfer fluid is returned to the evaporator section after cooling.

Claims

1. A cooling apparatus for removing heat, said cooling apparatus comprising:

a low profile unitary member having an evaporator portion and a condenser portion, the evaporator portion being thermally exposed to a heat generating component, the condenser portion being disposed at an elevated angle with respect to the evaporator portion;

a thermoelectric cooler disposed between, and thermally exposed to, the heat generating component and the evaporator portion;

a plurality of microtubes disposed within the low profile unitary member, the plurality of microtubes having a heat transfer fluid contained therein;

wherein heat is transferred, via the thermoelectric cooler, from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion;

wherein heated heat transfer fluid migrates to the condenser portion of the low profile unitary member by way of the microtubes;

wherein the heat transfer fluid is cooled in the condenser portion of the low profile unitary member;

and

wherein the heat transfer fluid is returned to the evaporator section after cooling.

2. The cooling apparatus of claim 1, wherein transfer of heat from the heat generating component to the heat transfer fluid results in the heat transfer fluid changing from a liquid to a gas.

3. The cooling apparatus of claim 1, wherein cooling of the heat transfer fluid within the condenser section results in the heat transfer fluid changing from a gas to a liquid.

4. The cooling apparatus of claim 1, further comprising a capillary groove on an interior surface of each microtube of the plurality of micro tubes.

5. The cooling apparatus of claim 1, wherein an interior space of the low profile unitary member is sealed.

6. The cooling apparatus of claim 1, wherein each microtube of the plurality of micro tubes is polygonal in cross section.

7. The cooling apparatus of claim 1, wherein each microtube of the plurality of micro tubes is substantially square in cross section.

8. The cooling apparatus of claim 1, wherein each microtube of the plurality of micro tubes has a diameter in the range of approximately 0.0625 inches to approximately 0.5 inches.

9. The cooling apparatus of claim 1, wherein the low profile unitary member has a profile of approximately 0.1 inches.

10. The cooling apparatus of claim 1, wherein each microtube of the plurality of micro tubes are substantially rectangular in shape.

11. The cooling apparatus of claim 1, wherein the heat generating component is a printed circuit board.

12. The cooling apparatus of claim 1, further comprising at least one fin disposed on an interior surface of each microtube of the plurality of micro tubes.

13. The cooling apparatus of claim 1, wherein the low profile unitary member is formed of a single piece of metal.

14. The cooling apparatus of claim 1, wherein the heat transfer fluid is migrated from the evaporator portion to the condenser portion by way.