Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation

• US 8,420,999 B2
• Filed: 05/08/2009
• Issued: 04/16/2013
• Est. Priority Date: 05/08/2009
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Costello, James, Tan, Wee Sin
• Primary Examiner(s): Luu, Thanh
• Assistant Examiner(s): Naphas, Renee
• Application Number:
  US12/463,361
• Publication Number:
  US 20100282951A1
• Time in Patent Office: 1,439 Days
• Field of Search: 250/221, 250/239, 250/551, 250/338.1, 257/82, 220/6, 220/520, 534/91
• US Class Current: 250/221
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01V 8/10 Detecting, e.g. by using light barriers by reflection from the object G01S17/00
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture

Abstract

An optical proximity sensor is provided that comprises an infrared light emitter operably connected to and driven by a light emitter driving circuit and a light detector operably connected to and driven by a detector sensing circuit. A metal housing or shield formed of metal and comprising first and second apertures surrounds the light emitter and the light detector such that at least a first portion of light emitted by the light detector passes through the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector. The metal housing or shield further comprises first and second modules within which the light detector and light detector are disposed, respectively. The first and second modules comprise adjoining optically opaque metal inner sidewalls that provide optical isolation between the first and second modules, where the first and second inner sidewalls are separated from one another by at least one metal tab foldably disposed therebetween. The at least one metal tab is configured to transfer a vertical force applied to one end of one module to an opposite end of the other module.

Claims

1. An optical proximity sensor, comprising:

an infrared light emitter operably connected to and driven by a light emitter driving circuit;

a light detector operably connected to and driven by a detector sensing circuit;

a metal housing or shield formed of metal and comprising first and second apertures located over the light emitter and the light detector, respectively, such that at least a first portion of light emitted by the light emitter passes through the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector;

wherein the metal housing or shield further comprises first and second modules within which the light emitter and light detector are disposed, respectively, the first and second modules comprising adjoining optically opaque metal inner sidewalls to provide optical isolation between the first and second modules, the first and second inner sidewalls further being separated from one another by at least one metal tab foldably disposed therebetween, the at least one metal tab being configured to transfer a vertical force applied to one end of one module laterally to an opposite end of the other module such that a corresponding force acts downwardly at the opposite end of the other module on an underlying substrate to which the housing or shield is attached.

2. The optical proximity sensor of claim 1, wherein the substrate comprises a printed circuit board operably connected to the sensor, the vertical force being transferred from the first module to the printed circuit board at a location disposed below the second module.

3. The optical proximity sensor of claim 1, wherein the substrate comprises a printed circuit board operably connected to the sensor, the vertical force being transferred from the second module to the printed circuit board at a location disposed below the first module.

4. The optical proximity sensor of claim 1, wherein the optical proximity sensor is incorporated into a portable electronic device.

5. The optical proximity sensor of claim 4, wherein the portable electronic device is a cellular telephone, a personal data assistant (PDA), a laptop computer, a notebook computer, or a computer.

6. The optical proximity sensor of claim 1, wherein the first and second sidewalls are separated from one another by at least two metal tabs disposed therebetween.

7. The optical proximity sensor of claim 1, wherein the first and second sidewalls are separated from one another by at least three metal tabs disposed therebetween.

8. The optical proximity sensor of claim 1, wherein the first and second sidewalls are separated from one another by at least four metal tabs disposed therebetween.

9. The optical proximity sensor of claim 1, wherein the at least one tab is foldably formed as a portion of the first or second modules.

10. The optical proximity sensor of claim 1, wherein the metal shield or housing is formed from a single piece of metal that is bent or folded into a final shape as the housing or shield.

11. The optical proximity sensor of claim 1, wherein the metal shield or housing further comprises first and second outer sidewalls.

12. The optical proximity sensor of claim 11, wherein the first and second outer sidewalls comprise folded tabs.

13. The optical proximity sensor of claim 1, wherein the metal shield or housing is formed from a single piece of stamped and subsequently folded steel.

14. The optical proximity sensor of claim 13, wherein the stamped steel comprises mild steel, nickel-plated steel or stainless steel.

15. A method of forming a metal housing or shield for an optical proximity sensor, comprising:

forming a flat sheet of metal configured to be folded into the shield or housing, the flat sheet of metal comprising a plurality of tabs extending outwardly therefrom;

folding the flat sheet of metal into first and second modules configured to house a light emitter and a light detector therewithin, respectively, such that the first and second modules comprise adjoining optically opaque metal inner sidewalls to provide optical isolation therebetween, the first and second inner sidewalls further being separated from one another by the plurality of tabs foldably disposed therebetween, the tabs and first and second modules further being configured to translate a vertical force applied to one end of one of the modules laterally to an opposite end of the other module such that a corresponding force acts downwardly at the opposite end of the other module to an underlying substrate to which the housing or shield is attached.

16. The method of claim 15, wherein forming the flat sheet of metal comprises stamping the flat sheet.

17. The method of claim 15, further comprising selecting mild steel, stainless steel or nickel-plated steel stock for the flat sheet.

18. The method of claim 15, further comprising mounting a light emitter and light emitter driving circuitry in the first module after the first module has been folded into shape.

19. The method of claim 15, further comprising mounting a light detector and light sensing circuitry in the second module after the second module has been folded into shape.

20. The method of claim 15, wherein the plurality of tabs comprise four individual tabs configured to be folded in between the first and second modules.