Microelectromechanical systems microphone packaging systems
First Claim
1. An apparatus comprising:
- a conductive frame;
a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame; and
an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
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Accused Products
Abstract
This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.
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Citations
20 Claims
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1. An apparatus comprising:
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a conductive frame; a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame; and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal. - View Dependent Claims (2, 3, 4, 5)
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6. An apparatus comprising:
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a silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, the silicon die including a silicon die terminal disposed on the bottom of the silicon die; an insulator coupled below the die, the insulator being of a first thickness along a first portion and a of second thickness less than the first thickness along a second portion surrounded by the first portion, with the first portion and the second portion defining a cavity, with the vibratory diaphragm of the silicon die disposed over the cavity and with the cavity opening to the vibratory diaphragm; a seal surrounding a space defined between the cavity and the vibratory diaphragm to define a sealed cavity; and a conductor electrically conductive with and extending from the silicon die terminal to a bottom of the insulator. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14)
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15. An apparatus comprising:
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a vibratory diaphragm assembly, including; a silicon die including a vibratory diaphragm with a silicon die port extending through the silicon die to the vibratory diaphragm, the silicon die including a silicon die terminal; and a cover coupled to the die to define a cavity, with the cavity disposed over the vibratory diaphragm of the silicon die, with the cavity opening to the vibratory diaphragm; and terminals coupled to the vibratory diaphragm assembly in electrical communication with the silicon die terminal, the terminals disposed on a bottom surface of the vibratory diaphragm assembly, with the cavity located below the bottom surface of the vibratory diaphragm assembly, with the terminals laterally spaced on opposite sides of the cavity. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification