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Integrated circuit packaging system with flex tape and method of manufacture thereof

  • US 8,421,202 B2
  • Filed: 03/03/2010
  • Issued: 04/16/2013
  • Est. Priority Date: 03/06/2009
  • Status: Active Grant
First Claim
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1. A method of manufacture of an integrated circuit packaging system comprising:

  • providing a substrate;

    attaching a device to the substrate;

    providing an interconnect on the substrate; and

    applying a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device.

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