Integrated circuit packaging system with flex tape and method of manufacture thereof
First Claim
Patent Images
1. A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate;
attaching a device to the substrate;
providing an interconnect on the substrate; and
applying a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device.
5 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a device to the substrate; providing interconnects on the substrate; and forming a flexible tape substantially conformal to the device and contacting the interconnects.
14 Citations
20 Claims
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1. A method of manufacture of an integrated circuit packaging system comprising:
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providing a substrate; attaching a device to the substrate; providing an interconnect on the substrate; and applying a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacture of an integrated circuit packaging system comprising:
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providing a substrate including a first side opposing a second side; attaching a device to the first side of the substrate; providing an interconnect on the first side of the substrate and an external terminal on the second side; and applying a flexible tape in a step shaped configuration over the device and contacting the interconnect, the flexible tape bent over an edge of the device. - View Dependent Claims (7, 8, 9, 10)
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11. An integrated circuit packaging system comprising:
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a substrate; a device over the substrate; an interconnect on the substrate; and a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification