Methods and systems for determining a characteristic of a wafer
First Claim
1. A method for determining a characteristic of a wafer, comprising:
- generating output responsive to light from the wafer using an inspection system, wherein the output comprises first output corresponding to defects on the water and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector; and
determining a value for the characteristic of the wafer using the second output and not the first output, wherein said determining comprises determining the value for the characteristic using a predetermined correlation between the second output and the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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Abstract
Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.
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Citations
34 Claims
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1. A method for determining a characteristic of a wafer, comprising:
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generating output responsive to light from the wafer using an inspection system, wherein the output comprises first output corresponding to defects on the water and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector; and determining a value for the characteristic of the wafer using the second output and not the first output, wherein said determining comprises determining the value for the characteristic using a predetermined correlation between the second output and the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A computer-implemented method for determining a characteristic of a wafer, comprising:
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acquiring output responsive to light from the wafer generated by an inspection system, wherein the output comprises first output corresponding to defects on the wafer and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector of the inspection system; and determining a value for the characteristic of the wafer using the second output and not the first output, wherein said determining comprises determining the value for the characteristic using a predetermined correlation between the second output and the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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31. A system configured to determine a characteristic of a wafer, comprising:
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an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer, wherein the output comprises first output corresponding to defects on the wafer and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector of the inspection subsystem; and a processor configured to determine a value for the characteristic of the wafer using the second output and not the first output, wherein the value for the characteristic is determined using a predetermined correlation between the second output and the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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32. A method for determining a characteristic of a wafer, comprising:
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generating output responsive to light from the wafer using an inspection system, wherein the output comprises first output corresponding to defects on the wafer and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector; determining an average of the second output across an area on the wafer; and determining an average value for the characteristic of the wafer using the average of the second output and not the first output, wherein said determining comprises determining the average value for the characteristic using a predetermined correlation between the average of the second output and the average value for the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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33. A method for determining a characteristic of a film formed on a wafer, comprising:
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generating output responsive to light from the wafer using an inspection system, wherein the output comprises first output corresponding to defects on the wafer and second output that does not correspond to the defects, and wherein the first and second output are generated by the same detector; and determining a value for the characteristic of the film formed on the wafer using the second output and not the first output, wherein said determining comprises determining the value for the characteristic using a predetermined correlation between the second output and the characteristic, wherein the characteristic is a non-defect related characteristic of the film that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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34. A method for determining a characteristic of a wafer, comprising:
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generating output responsive to light from the wafer using an inspection system, wherein the output comprises first output corresponding to defects on the wafer and second output that is noise and that does not correspond to the defects, and wherein the first and second output are generated by the same detector; and determining a value for the characteristic of the wafer using the noise and not the first output, wherein said determining comprises determining the value for the characteristic using a predetermined correlation between the noise and the characteristic, wherein the characteristic is a non-defect related characteristic of the wafer that can be measured using a metrology tool, and wherein the characteristic is a physical quantity of the wafer.
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Specification