Method and system for amplitude modulation utilizing a leaky wave antenna

• US 8,422,967 B2
• Filed: 12/30/2009
• Issued: 04/16/2013
• Est. Priority Date: 06/09/2009
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): Nguyen, Simon
• Application Number:
  US12/650,295
• Publication Number:
  US 20100311380A1
• Time in Patent Office: 1,203 Days
• Field of Search: 455/90, 455/121, 455/123, 4551271-1275, 455/129, 455/107, 343/731, 343/762, 343/771
• US Class Current: 455/127.1
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for amplitude modulation using a leaky wave antenna are disclosed and may include amplitude modulating an output of one or more power amplifiers in a wireless device by modulating a bias current in the power amplifiers that are coupled to one or more leaky wave antennas. The leaky wave antennas may include a balun that may be integrated on the chip, on a package to which the chip may be affixed, and/or integrated on a printed circuit board to which the chip may be affixed. An output power of the power amplifiers may be adjusted by configuring a bias voltage on the leaky wave antennas. The bias voltage may be configured utilizing a DC to DC voltage controller. The bias current may be modulated via one or more switched current sources. The switched current sources may be binary weighted and/or may be current mirrors.

Claims

1. A method for communication, the method comprising:

performing using one or more circuits in a wireless device, said one or more circuits comprising one or more power amplifiers on a chip, wherein said one or more power amplifiers are coupled to one or more leaky wave antennas without using matching circuitry for said one or more power amplifiers;

modulating a bias current in said one or more power amplifiers; and

amplitude modulating an output of said one or more power amplifiers utilizing said modulated bias current.

2. The method according to claim 1, wherein said one or more leaky wave antennas comprise a balun.

3. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on said chip.

4. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on a package to which said chip is affixed.

5. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on a printed circuit board to which said chip is affixed.

6. The method according to claim 1, comprising adjusting an output power of said one or more power amplifiers by configuring a bias voltage on said one or more leaky wave antennas.

7. The method according to claim 6, comprising configuring said bias voltage utilizing a DC to DC voltage controller.

8. The method according to claim 1, comprising modulating said bias current via one or more switched current sources.

9. The method according to claim 8, wherein said one or more switched current sources are binary weighted.

10. The method according to claim 8, wherein said one or more switched current sources are current mirrors.

11. A system for enabling communication, the system comprising:

one or more or more circuits in a wireless device, said one or more circuits comprising one or more power amplifiers on a chip, said one or more power amplifiers are coupled to one or more leaky wave antennas without using matching circuitry for said one or more power amplifiers, wherein said one or more or more circuits are operable to;

modulate a bias current in said one or more power amplifiers; and

amplitude modulate an output of said one or more power amplifiers utilizing said modulated bias current.

12. The system according to claim 11, wherein said one or more leaky wave antennas comprise a balun.

13. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on said chip.

14. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on a package to which said chip is affixed.

15. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on a printed circuit board to which said chip is affixed.

16. The system according to claim 11, wherein said one or more circuits are operable to adjust an output power of said one or more power amplifiers by configuring a bias voltage on said one or more leaky wave antennas.

17. The system according to claim 16, wherein said one or more circuits are operable to configure said bias voltage utilizing a DC to DC voltage controller.

18. The system according to claim 11, wherein said one or more circuits are operable to modulate said bias current via one or more switched current sources.

19. The system according to claim 18, wherein said one or more switched current sources are binary weighted.

20. The system according to claim 18, wherein said one or more switched current sources are current mirrors.