Structure and methodology for fabrication and inspection of photomasks by a single design system

• US 8,423,918 B2
• Filed: 03/08/2010
• Issued: 04/16/2013
• Est. Priority Date: 05/05/2005
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Rankin, Jed H., Watts, Andrew J.
• Primary Examiner(s): Thompson, A. M.
• Application Number:
  US12/719,059
• Publication Number:
  US 20100162196A1
• Time in Patent Office: 1,135 Days
• Field of Search: None
• US Class Current: 716/50
• CPC Class Codes: G03F 1/84 Inspecting

Abstract

A method and system for designing a photomask. The method provides a single machine methodology for inspecting photomasks having regions that repeat and regions that do not repeat. The method includes generating a chip dataset representing an integrated circuit chip design to be included in a cell region of a photomask, generating a kerf dataset to be included in the cell region, generating a kerf copy dataset, and merging the chip dataset, the kerf dataset and the kerf copy dataset into a photomask dataset representing a pattern of clear and opaque regions of the photomask.

Claims

1. A method of designing a photomask, comprising:

using a computer, generating a chip dataset representing an integrated circuit chip design to be included in a cell region of the photomask;

using a computer, generating a kerf dataset representing a kerf design to be included in the cell region;

determining a portion of the kerf dataset to copy;

using a computer, generating a kerf copy dataset, the kerf copy dataset including the portion of the kerf dataset to copy; and

using a computer, merging the chip dataset, the kerf dataset and the kerf copy dataset into a photomask dataset representing a pattern of clear and opaque regions of the photomask.

2. The method of claim 1, wherein the merging places a pattern of clear and opaque regions defined by the chip dataset and by the kerf dataset in the cell region of the photomask, said cell region surrounded by an opaque frame of the photomask and further places a pattern of clear and opaque regions defined by the kerf copy dataset in clear bar regions within said opaque frame.

3. The method of claim 1, further including:

using a computer, generating a write file containing coded instructions for controlling operation of a tool for transferring the photomask dataset representing the pattern of clear and opaque regions onto a blank mask substrate of a photomask fabrication line.

4. The method of claim 1, further including:

prior to the merging, determining a portion of the chip dataset to copy and using a computer, generating a chip copy dataset, the chip copy dataset including the portion of the chip dataset to copy; and

the merging also including merging the chip copy dataset into the photomask dataset.

5. The method of claim 4, wherein said chip region is surrounded by an opaque frame of the photomask and wherein the merging also places a pattern of opaque and clear regions defined by the chip copy dataset in clear bar regions within said opaque frame.

6. The method of claim 4, further including:

using a computer, generating a write file containing coded instructions for controlling operation of a tool for transferring the photomask dataset representing the pattern of clear and opaque regions onto a blank mask substrate of a photomask fabrication line.

7. The method of claim 1, wherein said chip dataset comprises two or more different chip designs.

8. The method of claim 1, wherein said kerf dataset comprises two or more different kerf designs.

9. The method of claim 1, wherein said kerf copy dataset comprises an exact copy of kerf dataset.

10. The method of claim 1, further including:

using a computer, generating a chip copy dataset, said chip copy dataset representing a less than whole contiguous portion of said integrated circuit chip design; and

using a computer, merging said chip copy dataset with said chip dataset, said kerf dataset and said kerf dataset into said photomask dataset.

11. A computer system comprising a processor, an address/data bus coupled to the processor, and a computer-readable memory unit coupled to communicate with the processor, the memory unit containing instructions that when executed implement a method of designing a photomask, the method comprising the computer implemented steps of:

generating a chip dataset representing an integrated circuit chip design to be included in a cell region of the photomask;

generating a kerf dataset representing a kerf design to be included in the cell region;

determining a portion of the kerf dataset to copy;

generating a kerf copy dataset, the kerf copy dataset including the portion of the kerf dataset to copy; and

merging the chip dataset, the kerf dataset and the kerf copy dataset into a photomask dataset representing a pattern of clear and opaque regions of the photomask.

12. The computer system of claim 11, wherein the merging places a pattern of clear and opaque regions defined by the chip dataset and by the kerf dataset in the cell region of the photomask, said cell region surrounded by an opaque frame of the photomask and further places a pattern of clear and opaque regions defined by the kerf copy dataset in clear bar regions within said opaque frame.

13. The computer system of claim 11, wherein the method further includes generating a write file containing coded instructions for controlling operation of a tool for transferring the photomask dataset representing the pattern of clear and opaque regions onto a blank mask substrate of a photomask fabrication line.

14. The computer system of claim 11, the method further including:

prior to the merging, determining a portion of the chip dataset to copy and generating a chip copy dataset, the chip copy dataset including the portion of the chip dataset to copy; and

the merging also including merging the chip copy dataset into the photomask dataset.

15. The computer system of claim 14, wherein said chip region is surrounded by an opaque frame of the photomask and wherein the merging also places a pattern of opaque and clear regions defined by the chip copy dataset in clear bar regions within said opaque frame.

16. The computer system of claim 14, the method further including generating a write file containing coded instructions for controlling operation of a tool for transferring the photomask dataset representing the pattern of clear and opaque regions onto a blank mask substrate of a photomask fabrication line.

17. The system of claim 11, wherein said chip dataset comprises two or more different chip designs.

18. The system of claim 11, wherein said kerf dataset comprises two or more different kerf designs.

19. The system of claim 11, wherein said kerf copy dataset comprises an exact copy of kerf dataset.

20. The system of claim 11, the method further including:

using a computer, generating a chip copy dataset, said chip copy dataset representing a less than whole contiguous portion of said integrated circuit chip design; and

using a computer, merging said chip copy dataset with said chip dataset, said kerf dataset and said kerf dataset into said photomask dataset.