Methods of forming tunable capacitors
First Claim
1. A method of forming a capacitor, comprising:
- a) depositing a main capacitor dielectric layer on a conductive substrate;
b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer, wherein forming the main upper electrode and the tuning electrodes comprises printing a metal precursor ink on the main capacitor dielectric layer in a pattern corresponding to the main upper electrode; and
c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes.
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Abstract
The present invention relates to methods of making and using tunable capacitors and devices. Using the methods described, one or more secondary tunable capacitors can be connected to a primary capacitor by printing a connector conducting layer or feature to obtain a desired net capacitance. Digitally printing the connector conducting layer allows the number of secondary capacitors connected into the circuit to be determined during the integrated circuit fabrication process, without the need for individual masks connecting the appropriate number of secondary capacitors. This provides an in-process or post-process trimming method to obtain the desired precision and accuracy for capacitors. Various sizes and combinations of secondary capacitors can be connected to obtain high precision capacitors and/or improved matching of capacitance values.
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Citations
28 Claims
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1. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer, wherein forming the main upper electrode and the tuning electrodes comprises printing a metal precursor ink on the main capacitor dielectric layer in a pattern corresponding to the main upper electrode; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a device comprising:
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a) forming a capacitator by (i) depositing a main capacitor dielectric layer on a conductive substrate, (ii) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer, and (iii) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes; b) forming a second dielectric layer on at least part of the substrate; and c) forming an antenna and/or inductor electrically connected to said conducting feature and said conductive substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer, wherein forming the main upper electrode and the plurality of tuning electrodes comprises printing a metal seed layer on the main capacitor dielectric layer and depositing a bulk metal on the seed layer by electroplating or electroless plating; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes.
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25. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer, wherein forming the main upper electrode and the plurality of tuning electrodes comprises depositing one or more semiconductor compounds on the main capacitor dielectric layer and recrystallizing the semiconductor material; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes.
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26. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate, wherein depositing the main capacitor dielectric layer comprises selectively printing a liquid-phase dielectric precursor material on the conductive substrate to form a pattern, and the method further comprises drying and/or curing the dielectric precursor; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes.
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27. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate, wherein depositing the main capacitor dielectric layer comprises covering the entire conductive substrate with a dielectric precursor ink and curing to form the dielectric layer, and the method further comprises etching the dielectric layer to form a pattern using subsequently formed structures as a mask; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes.
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28. A method of forming a capacitor, comprising:
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a) depositing a main capacitor dielectric layer on a conductive substrate; b) forming a main upper electrode and a plurality of tuning electrodes on said main capacitor dielectric layer; and c) printing one or more conductive features electrically connecting said main upper electrode to at least one of said tuning electrodes, wherein printing the one or more conductive features comprises printing a conductive seed layer and electroplating or electrolessly plating a bulk conductor on the conductive seed layer.
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Specification