Flow sensors having nanoscale coating for corrosion resistance

• US 8,424,380 B2
• Filed: 03/29/2012
• Issued: 04/23/2013
• Est. Priority Date: 12/18/2009
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Speldrich, Jamie, Beck, Scott E, Qasimi, Mohammed A. Javvad, Bey, Paul P
• Primary Examiner(s): Patel, Harshad R
• Application Number:
  US13/434,803
• Publication Number:
  US 20120192645A1
• Time in Patent Office: 390 Days
• Field of Search: None
• US Class Current: 73/204.26
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/3192 Multilayer coating
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01022 Titanium [Ti]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

A corrosion resistant flow sensor apparatus includes a flow sensor including a micromachinable substrate mounted on a package substrate that includes electrically conductive traces and substrate bond pads. The flow sensor includes a MEMS sensing structure for sensing a mass flow parameter and sensor bond pads coupled to the sensing structure. The sensor bond pads include a top metal layer on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall. Bond wires couple the sensor bond pads to the substrate bond pads. A housing including sides and a top portion is around the flow sensor and includes a flow channel having an inlet and an outlet. A multi-layer corrosion protection coating includes a nm scale adhesion layer and a self assembled monolayer (SAM) is on the adhesion layer. The protection coating covers the sensor bond pads including the metal diffusion barrier layer sidewall.

Claims

1. A corrosion resistant sensor, comprising:

a package having a plurality of package bond pads;

a sensor die mounted in the package, the sensor die including a sensing structure and a plurality of sensor bond pads electrically coupled to said sensing structure;

a plurality of bond wires coupling said plurality of sensor bond pads to corresponding package bond pads; and

a corrosion protection coating blanketed over the sensor die, the plurality of sensor bond pads, the package bond pads, and the bond wires.

2. The corrosion resistant sensor of claim 1, wherein the corrosion protection coating includes a multi-layer corrosion protection coating including an adhesion layer and a hydrophobic or hydrophilic layer.

3. The corrosion resistant sensor of claim 2, wherein the adhesion layer includes a nanometer-scale adhesion layer, and the hydrophobic or hydrophilic layer includes a self assembled monolayer (SAM).

4. The corrosion resistant sensor of claim 3, wherein said SAM has a thickness from 2 Angstroms to 10 nanometers.

5. The corrosion resistant sensor of claim 1, wherein the sensor bond pads include a top metal layer disposed on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall, and wherein the corrosion protection coating blankets over the sensor bond pads including over the metal diffusion barrier layer sidewall.

6. The corrosion resistant sensor of claim 1, wherein the package includes a substrate, and wherein the sensor die is mounted to the substrate.

7. The corrosion resistant sensor of claim 6, wherein at least some of the package bond pads are situated on the substrate.

8. The corrosion resistant sensor of claim 7, further comprising a signal processing circuit mounted relative to said substrate and electrically connected to at least some of the package bond pads on the substrate.

9. The corrosion resistant sensor of claim 6, wherein said substrate comprises a printed circuit board (PCB).

10. The corrosion resistant sensor of claim 1, wherein said sensing structure of said sensor die includes a flow sensor.

11. The corrosion resistant sensor of claim 1, wherein the corrosion protection coating is a multi-layer corrosion protection coating including a dielectric coating.

12. A corrosion resistant sensor, comprising:

a package substrate having a package substrate surface including a plurality of electrically conductive traces and substrate bond pads;

at least one sensor comprising a micromachined sensor substrate mounted on said package substrate surface including a sensing structure for sensing a parameter and a plurality of sensor bond pads coupled to said sensing structure for providing a sensing signal, wherein said sensor bond pads include a top metal layer disposed on a metal diffusion barrier layer including a metal diffusion barrier layer sidewall;

bond wires coupling said plurality of sensor bond pads to said substrate bond pads;

a housing situated around said sensor and said sensor bond wires, the housing including sides and a top portion, and

a multi-layer corrosion protection coating including a nanometer-scale adhesion layer, and a self assembled monolayer (SAM) that is hydrophobic or hydrophilic, wherein said multi-layer corrosion protection coating covers the sensor bond pads including over said metal diffusion barrier layer sidewall and covers said bond wires.

13. The corrosion resistant sensor of claim 12, wherein said package substrate includes a PCB, and said micromachined sensor substrate includes silicon.

14. The corrosion resistant sensor of claim 12, wherein said micromachined sensor substrate includes glass or quartz.

15. The corrosion resistant sensor of claim 12, further comprising a signal processing circuit on said package substrate surface electrically coupled to said sensor bond pads by said plurality of electrically conductive traces to receive and process said sensing signal from said sensing structure.

16. The corrosion resistant sensor of claim 12, wherein said top metal layer includes gold and said metal diffusion barrier layer includes a refractory metal.

17. The corrosion resistant sensor of claim 12, wherein said at least one sensor includes an airflow sensor that has a MEMS micro-bridge sensing structure.

18. The corrosion resistant sensor of claim 12, wherein said multi-layer corrosion protection coating further includes a fluid diffusion layer different from said adhesion layer between said adhesion layer and said SAM.

19. The corrosion resistant sensor of claim 18, wherein said fluid diffusion barrier layer is a nanometer thick layer and includes one or more of silicon oxide, silicon carbide, silicon nitride, or a silicon oxynitride layer.

20. The corrosion resistant sensor of claim 12, wherein said adhesion layer comprises one or more of alumina, titania or silica.

21. The corrosion resistant sensor of claim 20, wherein said metal diffusion barrier layer includes one or more of Ti, TiN, TiW, Ta, TaN, Zr, ZrN, V, Pt, Cr₂O₃, Ta₂O₅, or a combination thereof.

22. A method of forming a corrosion resistant sensor, comprising:

mounting a sensor die on a package substrate surface, said sensor die including a sensing structure for sensing a parameter and a plurality of sensor bond pads coupled to said sensing structure;

wire bonding said sensor bond pads to package bond pads on said package substrate surface; and

performing a blanket deposition of a multi-layer corrosion protection coating over the sensor die, the plurality of sensor bond pads, the package bond pads, and the bond wires.

23. The method of claim 22, wherein said blanket deposition is performed at a temperature of ≦

150°

C., and wherein said blanket deposition comprises;

depositing a nm scale adhesion layer; and

depositing a self assembled monolayer (SAM) that is hydrophobic or hydrophilic.