Phosphor position in light emitting diodes
First Claim
1. A method of forming an LED lamp with a desired distribution of phosphor, the method comprising:
- selecting a desired position of phosphor particles with respect to an LED chip;
selecting a particle size of a plurality of phosphor particles based on a viscosity of an uncured polymer resin in response to temperature changes and based on said desired position of the phosphor particles with respect to the LED chip;
mixing a plurality of phosphor particles in the uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin;
placing the uncured resin into a defined position adjacent the LED chip;
increasing the temperature of the resin in a first step to a temperature that correspondingly decreases the viscosity of the resin without immediately curing the resin;
encouraging the phosphor particles to settle in the lowered-viscosity resin to the desired position with respect to the LED chip; and
in response to the phosphor particles having settled at the desired position, thereafter increasing the temperature of the substantially uncured resin in a second step to a temperature higher than the first step and at which it will cure and solidify in about two hours or less.
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Accused Products
Abstract
A method of forming an LED lamp with a desired distribution of phosphor is disclosed. The method includes the steps of mixing a plurality of phosphor particles in an uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin. The uncured resin is then placed into a defined position adjacent an LED chip and the temperature of the resin is increased to correspondingly decrease its viscosity but to less than the temperature at which the resin would cure unreasonably quickly. The phosphor particles are encouraged to settle in the lowered-viscosity resin to a desired position with respect to the LED chip, and the temperature of the resin is thereafter increased to the point at which it will cured and solidify.
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Citations
43 Claims
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1. A method of forming an LED lamp with a desired distribution of phosphor, the method comprising:
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selecting a desired position of phosphor particles with respect to an LED chip; selecting a particle size of a plurality of phosphor particles based on a viscosity of an uncured polymer resin in response to temperature changes and based on said desired position of the phosphor particles with respect to the LED chip; mixing a plurality of phosphor particles in the uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin; placing the uncured resin into a defined position adjacent the LED chip; increasing the temperature of the resin in a first step to a temperature that correspondingly decreases the viscosity of the resin without immediately curing the resin; encouraging the phosphor particles to settle in the lowered-viscosity resin to the desired position with respect to the LED chip; and in response to the phosphor particles having settled at the desired position, thereafter increasing the temperature of the substantially uncured resin in a second step to a temperature higher than the first step and at which it will cure and solidify in about two hours or less. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of forming an LED lamp comprising:
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selecting a desired position of the phosphor with respect to an appropriate lamp package; selecting a particle size of a phosphor based upon an intermediate temperature that lowers a viscosity of a resin for a time sufficient for the phosphor to settle to the desired position without rapidly curing the resin; selecting and mixing a combination of a phosphor and a resin into a suspension that will remain homogeneous at a temperature of about 40°
C. or less for a time interval sufficient to permit the suspension to be dispensed into the appropriate lamp package;dispensing the homogeneous mixture of phosphor and resin into a lamp package; orienting the lamp package in a manner that allows the phosphor to settle to a desired position when the temperature is raised to an intermediate higher temperature that lowers the resin viscosity; raising the temperature to the intermediate higher temperature that lowers the resin viscosity for a time sufficient for the phosphor to settle to the desired position without rapidly curing the resin; and in response to the phosphor having settled at the desired position, raising the temperature to a point at which the substantially uncured resin cures within between about 5 minutes and 5 hours with the phosphor in the desired position. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of forming an LED lamp with a desired distribution of phosphor, the method comprising:
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selecting a desired position of phosphor particles with respect to an LED chip; selecting a particle size of a plurality of phosphor particles based upon a temperature that correspondingly decreases a viscosity of an uncured polymer resin and based on the desired position of the phosphor particles with respect to the LED chip; mixing the plurality of phosphor particles in the uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin; placing the uncured resin into a defined position adjacent the LED chip; increasing the temperature of the resin in a first step to a temperature that correspondingly decreases the viscosity of the resin but that is less than the temperature at which the resin would cure unreasonably quickly; encouraging the phosphor particles to settle in the lowered-viscosity resin to the desired position with respect to the LED chip for a period of at least about 10 minutes; and in response to the phosphor particles having settled at the desired position, thereafter increasing the temperature of the substantially uncured resin to the point at which it will cure and solidify. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification