Method of forming a micro light emitting diode array
First Claim
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1. A method of forming a micro LED array comprising:
- patterning a bonding layer on a carrier substrate to form a plurality of laterally separate locations of the bonding layer;
transferring a p-n diode layer and a metallization layer to the carrier substrate after patterning the bonding layer;
patterning the p-n diode layer to form a plurality of separate micro p-n diodes;
forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes.
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
211 Citations
30 Claims
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1. A method of forming a micro LED array comprising:
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patterning a bonding layer on a carrier substrate to form a plurality of laterally separate locations of the bonding layer; transferring a p-n diode layer and a metallization layer to the carrier substrate after patterning the bonding layer; patterning the p-n diode layer to form a plurality of separate micro p-n diodes; forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 18, 19, 20, 21, 22)
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14. A method of forming a micro LED array comprising:
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transferring a p-n diode layer and a metallization layer to a carrier substrate, wherein transferring comprises bonding the metallization layer to a bonding layer on the carrier substrate; patterning the p-n diode layer to form a plurality of separate micro p-n diodes; patterning the metallization layer to form a respective plurality of separate locations of the metallization layer after transferring the p-n diode layer and the metallization layer to the carrier substrate and after patterning the p-n diode layer to form the plurality of separate micro p-n diodes; patterning the bonding layer on the carrier substrate to form a respective plurality of laterally separate locations of the bonding layer; and forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes. - View Dependent Claims (15, 16, 17)
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23. A method of forming a micro LED array comprising:
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transferring a p-n diode layer and a metallization layer from a growth substrate to a plurality of pillars on a carrier substrate; patterning the p-n diode layer to form a plurality of separate micro p-n diodes; and forming a conformal dielectric barrier layer spanning sidewalls of the plurality of separate micro p-n diodes. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30)
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Specification