Method of manufacturing semiconductor device, solid-state imaging device, and solid-state imaging apparatus
First Claim
1. A method of manufacturing a semiconductor device comprising:
- forming a gate electrode of a transistor on an insulator layer on a surface of a semiconductor substrate;
forming an isolation region by performing ion implantation of an impurity of a first conductivity type into the semiconductor substrate;
forming a lightly doped drain region by performing, after forming a mask pattern including an opening portion narrower than a width of the gate electrode on an upper layer of the gate electrode of the transistor, ion implantation of an impurity of a second conductivity type near the surface of the semiconductor substrate with the mask pattern as a mask; and
forming a source region and a drain region of the transistor by performing ion implantation of an impurity of the second conductivity type into the semiconductor substrate after forming the gate electrode of the transistor.
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Accused Products
Abstract
A method of manufacturing a semiconductor device includes the steps of forming a gate electrode of a transistor on an insulator layer on a surface of a semiconductor substrate, forming an isolation region by performing ion implantation of an impurity of a first conductivity type into the semiconductor substrate, forming a lightly doped drain region by performing, after forming a mask pattern including an opening portion narrower than a width of the gate electrode on an upper layer of the gate electrode of the transistor, ion implantation of an impurity of a second conductivity type near the surface of the semiconductor substrate with the mask pattern as a mask, and forming a source region and a drain region of the transistor by performing ion implantation of an impurity of the second conductivity type into the semiconductor substrate after forming the gate electrode of the transistor.
9 Citations
5 Claims
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1. A method of manufacturing a semiconductor device comprising:
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forming a gate electrode of a transistor on an insulator layer on a surface of a semiconductor substrate; forming an isolation region by performing ion implantation of an impurity of a first conductivity type into the semiconductor substrate; forming a lightly doped drain region by performing, after forming a mask pattern including an opening portion narrower than a width of the gate electrode on an upper layer of the gate electrode of the transistor, ion implantation of an impurity of a second conductivity type near the surface of the semiconductor substrate with the mask pattern as a mask; and forming a source region and a drain region of the transistor by performing ion implantation of an impurity of the second conductivity type into the semiconductor substrate after forming the gate electrode of the transistor. - View Dependent Claims (2, 3)
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4. A semiconductor device comprising:
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an isolation region which is an impurity region of a first conductivity type; a source region and a drain region of a transistor which are impurity regions of a second conductivity type; a gate electrode of the transistor which is provided on an insulator layer on a surface of a semiconductor substrate formed with the isolation region and the source region and the drain region of the transistor; and a lightly doped drain region of the second conductivity type which is provided near the surface of the semiconductor substrate in a region narrower than a width of the gate electrode of the transistor. - View Dependent Claims (5)
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Specification