Widebody coil isolators
First Claim
Patent Images
1. A coil isolator, comprising:
- a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils;
a first lead frame comprising a first IC die pad, anda second lead frame comprising a second IC die pad;
wherein the first and second lead frames are separated by a gap, the first IC pad has a first IC attached thereto, the second IC pad has a second IC attached thereto, the coil transducer extends horizontally across the gap between the first and second lead frames and the first and second ends extend onto the first and second lead frames, no portions of the first and second lead frames are disposed vertically over or beneath any portions of the first and second coils, the coil wirebond pads are disposed vertically over or beneath the first and second lead frames, respectively, and the gap is filled substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS.
8 Assignments
0 Petitions
Accused Products
Abstract
Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.
167 Citations
36 Claims
-
1. A coil isolator, comprising:
-
a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; a first lead frame comprising a first IC die pad, and a second lead frame comprising a second IC die pad; wherein the first and second lead frames are separated by a gap, the first IC pad has a first IC attached thereto, the second IC pad has a second IC attached thereto, the coil transducer extends horizontally across the gap between the first and second lead frames and the first and second ends extend onto the first and second lead frames, no portions of the first and second lead frames are disposed vertically over or beneath any portions of the first and second coils, the coil wirebond pads are disposed vertically over or beneath the first and second lead frames, respectively, and the gap is filled substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A coil isolator, comprising:
-
a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; a substrate having at least one aperture disposed therethrough, the at least one aperture having at least one periphery; a first lead frame comprising an integrated circuit (IC) die pad, the first lead frame being located near the substrate but separated therefrom by a first gap, the first IC pad having a first IC attached thereto; a second lead frame comprising a second IC die pad, the second lead frame being located near the substrate but separated therefrom by a second gap, the second IC pad having a second IC attached thereto, wherein the coil transducer extends horizontally across the aperture and the first and second ends extend at least partially beyond the periphery and onto or beneath non-aperture portions of the substrate, the non-aperture portions of the substrate are not disposed vertically over or beneath any portions of the first and second coils, the coil wirebond pads are disposed vertically over or beneath non-aperture portions of the substrate, and the first and second gaps are filled substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
-
21. A coil isolator, comprising:
-
a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; a first lead frame comprising an integrated circuit (IC) die pad, the first IC pad having a first IC attached thereto; a second lead frame comprising a second IC die pad, the second lead frame being located near the first lead frame and separated therefrom by a gap, the second IC pad having a second IC attached thereto, the second lead frame having at least one aperture disposed therethrough, the aperture having at least one periphery; wherein the coil transducer extends horizontally across the aperture and the first and second ends extend at least partially beyond the periphery and onto or beneath non-aperture portions of the second lead frame, the non-aperture portions of the second lead frame are not disposed vertically over or beneath any portions of the first and second coils, the coil wirebond pads are disposed vertically over or beneath non-aperture portions of the second lead frame, and the gap is filled substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
-
-
31. A method of making a coil isolator, comprising:
-
providing a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; providing a first integrated circuit (IC), a second IC, and first and second lead frames, the first lead frame including a first IC die pad, the second lead frame including a second IC pad; placing the first and second lead frames near one another such that the first and second lead frames are separated by a gap; attaching the first and second ICs to the first and second IC pads, respectively; attaching the coil transducer to the first and second lead frames such that the coil transducer extends horizontally between the first and second lead frames and the first and second ends extend onto or beneath at least portions of the first and second lead frames, no portions of the first and second lead frames are disposed vertically over or beneath any portions of the first and second coils, and the wire bond pads of the first and second coils are disposed vertically over or beneath the first and second lead frames, respectively, and filling the gap substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (32)
-
-
33. A method of making a coil isolator, comprising:
-
providing a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; providing a substrate having at least one aperture disposed therethrough, the aperture having at least one periphery; providing a first integrated circuit (IC) and a first lead frame comprising a first IC die pad; providing a second IC and a second lead frame comprising a second IC die pad; attaching the first IC to the first IC pad and the second IC to the second IC pad; attaching the coil transducer to the substrate such that the coil transducer extends horizontally across the aperture and at least portions of the first and second ends extend beyond the periphery and onto or beneath non-aperture portions of the substrate, non-aperture portions of the substrate are not disposed vertically over or beneath any portions of the first and second coils, and the wire bond pads of the first and second coils are disposed vertically over or beneath non-aperture portions of the substrate; placing the first lead frame near the substrate such that the first lead frame and the substrate are separated by a first gap; placing the second lead frame near the substrate such that the second lead frame and the substrate are separated by a second gap, and filling the first and second gaps substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (34)
-
-
35. A method of making a coil isolator, comprising:
-
providing a coil transducer having opposing first and second ends and comprising a dielectric barrier having opposing first and second sides, the dielectric barrier comprising an electrically insulating, non-metallic, non-semiconductor, low-dielectric-loss material, a first electrically conductive transmitter coil disposed near or on the first side, first leads extending between the first coil and wire bond pads corresponding thereto, and a second electrically conductive receiver coil disposed near or on the second side, second leads extending between the second coil and wire bond pads corresponding thereto, the dielectric barrier being disposed between the first and second coils; providing a first integrated circuit (IC) and a first lead frame comprising a first IC die pad; providing a second IC and a second lead frame comprising a second IC die pad having at least one aperture disposed therethrough, the aperture having at least one periphery; attaching the first IC to the first IC pad and the second IC to the second IC die pad; attaching the coil transducer to the second lead frame such that the coil transducer extends horizontally across the aperture and at least portions of the first and second ends extend beyond the periphery and onto or beneath non-aperture portions of the second lead frame, non-aperture portions of the second lead frame are not disposed vertically over or beneath any portions of the first and second coils, and the wire bond pads of the first and second coils are disposed vertically over or beneath non-aperture portions of the second lead frame; placing the first lead frame near the second lead frame such that the first lead frame and the second lead frame are separated by a gap, and filling the gap substantially with at least one electrically non-conductive material having a voltage breakdown exceeding about 2,000 volts RMS. - View Dependent Claims (36)
-
Specification