Process for measuring an adhesion energy, and associated substrates

• US 8,429,960 B2
• Filed: 10/22/2010
• Issued: 04/30/2013
• Est. Priority Date: 08/24/2010
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Soitec S.A.
• Inventors: Landru, Didier
• Primary Examiner(s): ALLEN, ANDRE J
• Application Number:
  US12/910,023
• Publication Number:
  US 20120048007A1
• Time in Patent Office: 921 Days
• Field of Search: 731/50.A
• US Class Current: 73/150.A
• CPC Class Codes: G01N 19/04 Measuring adhesive force between materials, e.g. of sealing tape, of coating

Abstract

The invention relates to a structure and a process for measuring an energy of adhesion between two substrates bonded in a transverse direction. The method involves providing for at least one of the two substrates to have a plurality of elementary test cells within a test layer each being capable of locally applying, in the transverse direction, a preset mechanical stress (σ), dependent on the temperature (T), to a bond interface between the substrates in a direction tending to separate them, applying a test temperature to the substrates and identifying debonded regions of the bond interface so that the local adhesion energy at the test temperature in the regions may be deduced therefrom, the local adhesion energy in a region of the bond interface being deduced from the stress applied by the test cells that caused debonding in the region.

Claims

1. A process for measuring an energy of adhesion between two bonded substrates which comprises:

providing a test layer on a first substrate, wherein the test layer has an exposed surface;

providing a plurality of elementary test cells within the test layer for locally applying a preset mechanical stress (σ

) dependent on a temperature (T);

bonding a second substrate to the exposed surface of the test layer to form a bonding interface; and

increasing the temperature (T) of the bonded substrates to up to a test temperature (T_t), wherein the plurality of elementary test cells apply a preset transverse tensile stress to the bond interface so as to deduce the adhesion energy.

2. The process of claim 1, which further comprises providing a bonding layer on the exposed surface of the test layer, and bonding the second substrate to the surface of the bonding layer, such that the bonding layer is between the second substrate and the test layer and test cells within the test layer.

3. The process of claim 1, which further comprises

applying the test temperature to the substrates, wherein each of the plurality of elementary test cells apply a different preset mechanical stress (σ

), at the test temperature (T_t) locally to the bond interface in the transverse direction at the bond interface between the substrates in a direction tending to separate the bonded surfaces; and

identifying debonded regions at the bond interface associated with one or more elementary test cells applying the different preset mechanical stress (σ

), such that the local adhesion energy at the test temperature in the regions may be deduced from which test cells are associated with a debonded region.

4. The process of claim 3, which further comprises:

repeating the steps of applying a test temperature (T_t) to the substrates over a range of temperatures (T); and

identifying the debonded regions of the bond interface at the several different test temperatures (T_t) in the range, so as to deduce the adhesion energy over the range of temperatures.

5. The process of claim 3, in which the debonded regions of the bond interface are identified using an acoustic microscope.

6. The process of claim 1, wherein each elementary test cell within the test layer comprises two pads where both pads are made of a material that expands when heated, and further wherein each test cell applies a different preset mechanical stress (σ

) at the same test temperature (T_t), compared to the other test cells within the test layer.

7. The process of claim 6, wherein a plurality of elementary test cells forms a test structure, and each test cell within the test structure applies a different preset stress at the same preset test temperature, such that the test structure indicates the local adhesion energy at the bond interface by identifying the debonded regions between one test cell and another.

8. The process of claim 7, wherein the test layer comprises a plurality of test structures distributed over the surface of the first substrate so as to apply stresses to a plurality of different regions of the bond interface, wherein each test structure comprises a plurality of elementary test cells that apply a different preset mechanical stress at the same test temperature.

9. The process of claim 7, wherein each test cell is physically differentiated from the other test cells in a test structure by a set of parameters comprising a preset stress applied by the cell and a preset temperature at which the stress is applied, or a local adhesion energy and a temperature at which the adhesion energy is reached;

and the process further comprises the step of deducing the adhesion energy by determining which test cells with a preset set of parameters are associated with a debonded region.

10. A substrate capable of measuring an energy of adhesion between itself and another substrate at a bond interface comprising:

a first substrate;

a test layer formed on the first substrate, wherein the test layer has an exposed surface for bonding;

a plurality of elementary test cells formed within the test layer for locally applying in a transverse direction, a preset mechanical stress (σ

) dependent on the temperature (T), to a bond interface located between the surface of the test layer and another substrate bonded thereto.

11. The substrate of claim 10, further comprising:

a second substrate bonded to the exposed surface of the test layer to form a bond interface, wherein the test layer and bond interface are at a test temperature; and

locally debonded regions at the bond interface, wherein one of the debonded regions is associated with one elementary test cell applying the preset mechanical stress (σ

) at the test temperature (T_t), where the preset mechanical stress is different from one elementary test cell to another at the test temperature, such that the local adhesion energy in a region may be determined by which test cell is associated with a debonded region.

12. The substrate of claim 10, further comprising a bond layer formed on the surface of the test layer, such that the bonding layer is between the second substrate and the test layer, wherein the test cells are distributed in the test layer and covered by the bond layer, and a surface of the bond layer forms the bond interface with the second substrate.

13. The substrate of claim 10, wherein the first substrate is a transparent support layer upon which the test layer and elementary test cells are formed.

14. The substrate of claim 10, wherein the elementary test cells are at the free surface of the test layer, such that the test cells apply the preset mechanical stress to the second substrate at the bond interface.

15. The substrate of claim 10, further comprising a plurality of test structures wherein each test structure has a plurality of different elementary test cells capable of applying different mechanical stresses to a plurality of regions of the bond interface at a preset temperature.

16. The substrate of claim 10, wherein each elementary test cell within the test layer comprises two pads where both pads are made of a material that expands when heated.

17. The substrate of claim 11, in which each cell is physically differentiated by a set of parameters comprising a preset stress applied by the cell and a preset temperature at which the stress is applied, or a local adhesion energy and a temperature at which the energy is reached.

18. The substrate of claim 11, wherein at least the first substrate or the second substrate include electronic circuits.

19. The substrate of claim 11, associated with an acoustic microscope for identifying debonded regions.