Illuminating device and method for manufacturing the same

• US 8,430,527 B2
• Filed: 06/01/2010
• Issued: 04/30/2013
• Est. Priority Date: 09/29/2009
• Status: Expired due to Fees

• Current Assignee: Liang MENG Plastic Share Company Limited
• Original Assignee: Liang MENG Plastic Share Company Limited
• Inventors: Lai, Kuang-Chu
• Primary Examiner(s): Truong, Bao Q
• Application Number:
  US12/791,030
• Publication Number:
  US 20110075421A1
• Time in Patent Office: 1,064 Days
• Field of Search: 362/311.02, 362/311.14, 362/311.15, 362/249.02, 362/294, 362/373, 362/331, 362/268, 362/311.06, 362/244, 362/240, 362/245, 362/246, 362/237, 362/238
• US Class Current: 362/244
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/00 Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof H10K50/00 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components having potential barriers, specially adapted for light emission H01L27/15; semiconductor lasers H01S5/00

Abstract

A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements.

Claims

1. An illuminating device, including:

a molded casing formed by a metallic substrate, the casing having a bottom plate and a plurality of surrounding plates extending upwards from each side of the bottom plate;

an electrical conductive circuit formed on an inner surface of the bottom plate in an insulating manner;

a plurality of light-emitting elements arranged in matrix to be located on the bottom plate and electrically connected with the electrical conductive circuit;

a plurality of transparent caps covering the light-emitting elements, respectively;

a transparent body filled in the casing to cover on the electrical conductive circuit and the transparent caps, and over-molded outside the casing to partially cover on the surrounding plates, wherein a plurality of light-guiding posts are formed to be extended upwards from a surface of the transparent body, and each light-guiding post is located at a position corresponding to one corresponding transparent cap and the light-emitting element; and

a lamp cover over-molded outside the casing from the surrounding plates.

2. The illuminating device according to claim 1, further including a waterproof strip, an outer surface of the lamp cover being formed with an insertion slot, the waterproof strip being inserted into the insertion slot to surround an outer periphery of the casing at the bottom plate.

3. The illuminating device according to claim 2, further including a heat sink, the heat sink being adhered to the casing so as to press the waterproof strip.

4. The illuminating device according to claim 3, wherein the heat sink comprises a thermal-conducting layer adhered to the casing and a heat-dissipating body adhered to the thermal-conducting layer to press the waterproof strip.

5. The illuminating device according to claim 1, wherein one of the surrounding plates is provided with two through-holes, and a pair of contacts of the electrical conductive circuit is provided to correspond to the two through-holes, respectively.

6. The illuminating device according to claim 1, further comprising an electrical connector fixed to the casing from outside of the surrounding plate, wherein a pair of electrical conductive rods of the electrical connector is inserted into the two through-holes and electrically connected with the electrical conductive circuit through the pair of contacts, respectively.

7. The illuminating device according to claim 6, wherein the electrical connector is a socket.