Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device
First Claim
1. A method of manufacturing a semiconductor device, comprising:
- preparing a semiconductor wafer including (i) a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP and (ii) a second semiconductor layer that is a group 3-5 compound formed to contact the first semiconductor layer and that lattice matches or pseudo-lattice matches with InP;
forming an oxide layer by selectively oxidizing the second semiconductor layer relative to the first semiconductor layer; and
forming a control electrode above the oxide layer.
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Accused Products
Abstract
It is an objective of the present invention to form a favorable interface between an oxide layer and a group 3-5 compound semiconductor using a practical and simple method.
Provided is a semiconductor wafer comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; and a second semiconductor layer that is formed to contact the first semiconductor layer, is a group 3-5 compound semiconductor layer that lattice matches or pseudo-lattice matches with InP, and can be selectively oxidized relative to the first semiconductor layer. Also provided is a semiconductor device comprising a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP; an oxide layer formed by selectively oxidizing, relative to the first semiconductor layer, at least a portion of a second semiconductor layer that is a group 3-5 compound formed to contact the first semiconductor layer and that lattice matches or pseudo-lattice matches with InP; and a control electrode that adds an electric field to a channel formed in the first semiconductor layer.
34 Citations
5 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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preparing a semiconductor wafer including (i) a first semiconductor layer that is a group 3-5 compound not containing arsenic and that lattice matches or pseudo-lattice matches with InP and (ii) a second semiconductor layer that is a group 3-5 compound formed to contact the first semiconductor layer and that lattice matches or pseudo-lattice matches with InP; forming an oxide layer by selectively oxidizing the second semiconductor layer relative to the first semiconductor layer; and forming a control electrode above the oxide layer. - View Dependent Claims (2, 3, 4, 5)
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Specification