Semiconductor light emitting device and method for manufacturing the same

• US 8,431,949 B2
• Filed: 03/11/2009
• Issued: 04/30/2013
• Est. Priority Date: 03/11/2008
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Kobayakawa, Masahiko, Okazaki, Tomokazu
• Primary Examiner(s): Rodela, Eduardo A
• Application Number:
  US12/401,919
• Publication Number:
  US 20090230424A1
• Time in Patent Office: 1,511 Days
• Field of Search: 257/98, 257/99, 257/100, 257/E33.056, 257/E33.057, 257/E33.058, 257/E33.059, 257/E33.062, 257/E33.065
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a semiconductor light emitting element, a first lead including an element mount portion on which the semiconductor light emitting element is mounted, and a second lead electrically connected to the semiconductor light emitting element. The light emitting device further includes a resin package covering the semiconductor light emitting element and part of each of the first and the second leads. The resin package includes a lens portion facing the semiconductor light emitting element. The first lead includes a pair of standing portions spaced from each other with the element mount portion intervening between them and a pair of terminal portions extending from the standing portions in mutually opposite directions. Each of the standing portions projects from the resin package in a direction away from the lens portion.

Claims

1. A light emitting device, comprising:

a semiconductor light emitting element;

a first lead including an element mount portion on which the semiconductor light emitting element is mounted;

a second lead electrically connected to the semiconductor light emitting element; and

a resin package covering the semiconductor light emitting element and part of each of the first and the second leads, the resin package including a lens portion facing the semiconductor light emitting element and a bottom surface opposite to the lens portion;

wherein the first lead includes a pair of first standing portions and a pair of first terminal portions, the first standing portions being spaced from each other with the element mount portion intervening therebetween, the first terminal portions extending from the first standing portions in opposite directions and in a direction in which the first standing portions are spaced from each other, and wherein each of the first standing portions projects from the bottom surface of the resin package in a direction away from the lens portion, and each of the first terminal portions is spaced apart from the bottom surface of the resin package and extends in parallel to the bottom surface of the resin package,

wherein the second lead includes a pair of second standing portions and a pair of second terminal portions, the second terminal portions extending from the second standing portions in opposite directions, each of the second standing portions projecting from the bottom surface of the resin package in a direction away from the lens portion, each of the second terminal portions extending in parallel to the bottom surface of the resin package,

wherein the first terminals and the second terminal portions are flush with each other so as to extend along and in contact with a common plane, and

wherein one of the first terminal portions and the second terminal portions is different in width from the other three terminal portions.

2. The light emitting device according to claim 1, wherein the second lead includes a pad for bonding a wire, the pad being disposed between the second standing portions.

3. The light emitting device according to claim 2, wherein the standing portions of at least one of the first and the second leads is designed to increase a distance therebetween as proceeding away from the lens portion.

4. The light emitting device according to claim 1, wherein the element mount portion is formed with a recess in which the semiconductor light emitting element is provided.

5. The light emitting device according to claim 1, wherein the pair of standing portions are integrally connected to the element mount portion.