Method and structure of monolithetically integrated inertial sensor using IC foundry-compatible processes
First Claim
1. A monolithic MEMS and CMOS integrated circuit device comprising:
- a first semiconductor substrate having a first surface region;
one or more CMOS integrated circuit devices provided on a CMOS integrated circuit device region overlying the first surface region, the CMOS integrated circuit device region having a CMOS surface region;
a dielectric region overlying the CMOS surface region, the dielectric region having a cavity region provided therein;
a second semiconductor substrate having a second surface region overlying the dielectric region and enclosing the cavity region, the second semiconductor substrate having a spring region overlying a vicinity of the cavity region;
a first piezo resistor device provided within a first portion of the spring region of the second semiconductor substrate;
a second piezo resistor device provided within a second portion of the spring region of the second semiconductor substrate; and
a mass of material coupled to a portion of the spring region of the second semiconductor substrate between the second piezo resistor device and the first piezo resistor device, the mass material being overlying the cavity region and coupled to the spring region to be movable from at least a first position to a second position and to be sensed respectively by either or both the first piezo resistor device and the second piezo resistor device.
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Abstract
The present invention relates to integrating an inertial mechanical device on top of a CMOS substrate monolithically using IC-foundry compatible processes. The CMOS substrate is completed first using standard IC processes. A thick silicon layer is added on top of the CMOS. A subsequent patterning step defines a mechanical structure for inertial sensing. Finally, the mechanical device is encapsulated by a thick insulating layer at the wafer level.
Comparing to the incumbent bulk or surface micromachined MEMS inertial sensors, the vertically monolithically integrated inertial sensors have smaller chip size, lower parasitics, higher sensitivity, lower power, and lower cost.
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Citations
20 Claims
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1. A monolithic MEMS and CMOS integrated circuit device comprising:
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a first semiconductor substrate having a first surface region; one or more CMOS integrated circuit devices provided on a CMOS integrated circuit device region overlying the first surface region, the CMOS integrated circuit device region having a CMOS surface region; a dielectric region overlying the CMOS surface region, the dielectric region having a cavity region provided therein; a second semiconductor substrate having a second surface region overlying the dielectric region and enclosing the cavity region, the second semiconductor substrate having a spring region overlying a vicinity of the cavity region; a first piezo resistor device provided within a first portion of the spring region of the second semiconductor substrate; a second piezo resistor device provided within a second portion of the spring region of the second semiconductor substrate; and a mass of material coupled to a portion of the spring region of the second semiconductor substrate between the second piezo resistor device and the first piezo resistor device, the mass material being overlying the cavity region and coupled to the spring region to be movable from at least a first position to a second position and to be sensed respectively by either or both the first piezo resistor device and the second piezo resistor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A monolithic MEMS and CMOS integrated circuit device comprising:
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a first semiconductor substrate having a first surface region; one or more CMOS integrated circuit devices provided on a CMOS integrated circuit device region overlying the first surface region, the CMOS integrated circuit device region having a CMOS surface region; a dielectric region overlying the CMOS surface region, the dielectric region having a cavity region provided therein; a second semiconductor substrate having a second surface region overlying the dielectric region and enclosing the cavity region, the second semiconductor substrate having a spring region overlying a vicinity of the cavity region; one or more free standing MEMS structures formed within one or more portions of the second semiconductor substrate; a mass of material coupled to a portion of the spring region of the second semiconductor substrate, the mass material being overlying the cavity region and coupled to the spring region to be movable from at least a first position to a second position and to be sensed by the one or more free standing MEMS structures; an enclosure layer overlying the one or more free standing MEMS structures, the enclosure layer comprising an open region between the free standing MEMS structures and the enclosure layer; and an encapsulating layer overlying the enclosure layer, the encapsulating layer substantially sealing the one or more free standing MEMS structures to form a predetermined environment within the open region. - View Dependent Claims (16, 17, 18, 19)
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20. A monolithic MEMS and CMOS integrated circuit device comprising:
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a first semiconductor substrate having a first surface region; one or more CMOS integrated circuit devices provided on a CMOS integrated circuit device region overlying the first surface region, the CMOS integrated circuit device region having a CMOS surface region; a dielectric region overlying the CMOS surface region, the dielectric region having a cavity region provided therein; a second semiconductor substrate having a second surface region overlying the dielectric region and enclosing the cavity region, the second semiconductor substrate having a spring region overlying a vicinity of the cavity region; a first piezo resistor device provided within a first portion of the spring region of the second semiconductor substrate; a second piezo resistor device provided within a second portion of the spring region of the second semiconductor substrate; a mass of material coupled to a portion of the spring region of the second semiconductor substrate between the second piezo resistor device and the first piezo resistor device, the mass material being overlying the cavity region and coupled to the spring region to be movable from at least a first position to a second position and to be sensed respectively by either or both the first piezo resistor device and the second piezo resistor device; an enclosure layer overlying the first and second piezo resistor devices, the enclosure layer comprising an open region between the first and second piezo resistor devices and the enclosure layer; and an encapsulating layer overlying the enclosure layer, the encapsulating layer substantially sealing the first and second piezo resistor devices to form a predetermined environment within the open region.
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Specification