MEMS package and method for the production thereof

• US 8,432,007 B2
• Filed: 03/30/2011
• Issued: 04/30/2013
• Est. Priority Date: 11/10/2005
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Leidl, Anton, Krueger, Hans, Stelzl, Alois, Pahl, Wolfgang, Seitz, Stefan
• Primary Examiner(s): Wagner, Jenny L
• Application Number:
  US13/075,936
• Publication Number:
  US 20110186943A1
• Time in Patent Office: 762 Days
• Field of Search: 257/416
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Claims

1. A micro electro-mechanical systems (MEMS) package, comprising:

a ceramic carrier substrate having a top side,

a MEMS chip mounted in a flip-chip configuration on the top side of the carrier substrate,

at least one chip component on, or above, the top side of the carrier substrate or embedded in the carrier substrate,

a metallic shielding layer above the MEMS chip and the at least one chip component, the metallic shielding layer forming a seal with the top side of the carrier substrate, and

an enclosure between the metallic shielding layer and the MEMS chip;

wherein;

the MEMS chip and the at least one chip component are electrically connected to each other or to external contacts on the carrier substrate;

the enclosure comprises a cover over at least part of the MEMS chip;

the MEMS chip and the at least one chip component are one next to the other and are electrically connected to terminal surfaces on the carrier substrate,

the enclosure seals the MEMS chip and the chip component to the carrier substrate separately, and

the metallic shielding layer is above the MEMS chip and the chip component.

2. The MEMS package of claim 1, wherein the enclosure comprises a laminate film applied above a surface area above the MEMS chip and the at least one chip component, the laminate film forming a seal with the carrier substrate.

3. The MEMS package of claim 1, wherein the enclosure comprises a rigid cap on the carrier substrate, the rigid cap and the carrier substrate defining a cavity, wherein the MEMS chip is in the cavity, and wherein the metallic shielding layer is directly on the rigid cap and on the carrier substrate in an edge region around the rigid cap.

5. The MEMS package of claim 1, wherein:

the MEMS chip has an active side that faces the top side of the carrier substrate, the MEMS chip being electrically and mechanically connected to the carrier substrate by one or more of bumps and electrically conductive adhesive,

the cover is above a passive side of the MEMS chip facing away from the top side of the carrier substrate,

the MEMS chip, the cover, and the at least one chip component are covered with the laminate film, and

the metallic shielding layer is on an outward surface of the laminate film.

6. The MEMS package of claim 5, wherein the electrically conductive adhesive comprises an anisotropic conductive adhesive having a conductivity that is perpendicular an adhesion surface.

18. The MEMS package of claim 1, wherein the carrier substrate comprises a diffusion-resistant material and the metallic shielding layer binds to the diffusion-resistant material circumferentially.

4. The MEMS package of claim wherein the metallic shielding layer is in contact with the MEMS chip and contacts the cover, side surfaces of the MEMS chip and the top side of the carrier substrate.

7. A method for producing a MEMS package, comprising:

mounting a MEMS chip in a flip-chip configuration on a carrier substrate, the carrier substrate comprising external contacts, the carrier substrate having a top side;

arranging a chip component on or above the top side of the carrier substrate,

creating an electrical connection between the MEMS chip, the chip component, and the external contacts on the carrier substrate,

adding an enclosure comprising a laminate film above the MEMS chip and the chip component to form a cover over the MEMS chip, and

applying a metallic shielding layer comprising a metallic layer above the enclosure, the metallic shielding layer forming a seal with the top side of the carrier substrate;

wherein

mounting the MEMS chip on the carrier substrate comprises mechanically connecting the MEMS chip to the carrier substrate by one or more of bumps and electrically conductive adhesive,

adding the enclosure to form the cover comprises adding the cover on a passive side of the MEMS chip facing away from the top side of the carrier substrate,

adding the enclosure comprises covering the MEMS chip, the cover, and the at least one chip component with the laminate film and applying the metallic shielding layer comprises applying the shielding layer on an outward surface of the laminate film.

8. The method of claim 7, wherein the enclosure comprises a laminate film, the laminate film forming a seal with the carrier substrate around the MEMS chip and the chip component, and

wherein applying the shielding layer comprises applying the shielding layer over a surface area on the laminate film and the carrier substrate such that the shielding layer forms a seal with the carrier substrate and is connected electrically at one or more positions to a contact surface of the carrier substrate.

9. The method of claim 7, wherein applying the shielding layer comprises generating the shielding layer at least partially by depositing metal from a solution.

10. The method of claim 7, wherein applying the shielding layer comprises generating the shielding layer at least partially by sputtering, a PVD or CVD process, or by evaporation of metal.

11. A micro electro-mechanical systems (MEMS) package comprising:

a ceramic carrier substrate having a top side,

a MEMS chip mounted in a flip-chip configuration on the top side of the carrier substrate,

at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate, and

a metallic shielding layer above the MEMS chip and the at least one chip component, the metallic shielding layer forming a seal with the top side of the carrier substrate,

an enclosure between the metallic shielding layer and the MEMS chip, the enclosure forming a cover over at least a part of the MEMS chip;

wherein;

the MEMS chip and the at least one chip component are one next to the other and electrically connected to each other or to external contacts on the carrier substrate;

an active side of the MEMS chip is electrically and mechanically connected to the carrier substrate by one or more of bumps and electrically conductive adhesive,

the cover is above a passive side of the MEMS chip facing away from the top side of the carrier substrate,

the MEMS chip, the cover, and the at least, one chip component are covered with the laminate film,

the metallic shielding layer above the MEMS chip and the chip component and is on an outward surface of the laminate film; and

the enclosure seals the MEMS chip and the chip component to the carrier substrate separately.

12. The MEMS package of claim 11, wherein the laminate film forms a seal with the carrier substrate.

13. The MEMS package of claim 11, wherein the enclosure comprises a rigid cap on the carrier substrate, the rigid cap and the carrier substrate defining a cavity, wherein the MEMS chip is in the cavity, and wherein the metallic shielding layer is directly on the rigid cap and on the carrier substrate in an edge region around the rigid cap.

14. The MEMS package of claim 11, wherein the metallic shielding layer is in contact with the MEMS chip and contacts the cover, side surfaces of the MEMS chip and the top side of the carrier substrate.

15. The MEMS package of claim 11, wherein:

the MEMS chip has an active side that faces the top side of the carrier substrate, the MEMS chip being electrically and mechanically connected to the carrier substrate by one or more of bumps and electrically conductive adhesive,

the cover is above a passive side of the MEMS chip facing away from the top side of the carrier substrate,

the MEMS chip, the cover, and the at least one chip component are covered with the laminate film, and

the metallic shielding layer is on an outward surface of the laminate film.

16. The MEMS package of claim 15, wherein the electrically conductive adhesive comprises an anisotropic conductive adhesive having a conductivity that is perpendicular an adhesion surface.

17. The MEMS package of claim 11, wherein the carrier substrate comprises a diffusion-resistant, material and the metallic shielding layer binds to the diffusion-resistant material circumferentially.