Printed circuit board and electro application

• US 8,432,706 B2
• Filed: 12/22/2009
• Issued: 04/30/2013
• Est. Priority Date: 07/29/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Han, Ryu, Chang-Sup
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US12/654,541
• Publication Number:
  US 20110026234A1
• Time in Patent Office: 1,225 Days
• Field of Search: 361/792, 361/748, 361/763, 361/818, 174/250, 174/255, 174260-262, 174/350, 174/360, 174/376, 174/377, 333/12, 333/167, 333/202, 333/204, 333/212, 333/238, 333/239, 333/246, 343/702, 343/729, 343/895, 343/913, 257/595, 257/664
• US Class Current: 361/792
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0236 Electromagnetic band-gap structures
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 9/0009 : with provisions to reduce EMI leakage through the joining parts
• CPC Class Codes: H05K 9/0052 : Shielding other than Faraday cages

Abstract

A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

Claims

1. A printed circuit board comprising:

a first board having an electronic component mounted thereon; and

a second board positioned on an upper side of the first board and covering at least a portion of an upper surface of the first board, an electromagnetic bandgap (EBG) structure being inserted into the second board such that a noise radiating upwards from the first board is shielded,

wherein the second board comprises

a first conductive body and a second conductive body disposed on a different surface, respectively;

a third conductive body disposed on a surface that is different from that of the second conductive body; and

a stitching via unit connecting the first conductive body to the third conductive body through the surface on which the second conductive body is disposed, the stitching via being electrically separated from the second conductive body, and

wherein the electronic component is mounted on a surface of the first board, and the second board is stacked on the upper surface of the first board while a portion corresponding to the position of the electronic component is opened.

2. The printed circuit board of claim 1, wherein the second board is adhered to the upper surface of the first board by way of adhesive.

3. The printed circuit board of claim 1, wherein the second board further comprises:

a pair of fourth conductive bodies separately disposed on a same surface;

a fifth conductive body disposed on a surface that is different from that of the fourth conductive bodies;

a sixth conductive body disposed between the fourth conductive bodies and the fifth conductive body; and

a stitching via unit connecting the pair of fourth conductive bodies to each other through the fifth conductive body, the stitching via unit being electrically separated from the sixth conductive body.