Heat sink formed with conformal shield
First Claim
1. A method of manufacturing a module comprising:
- providing a laminate;
providing an electronic component on a component area on an upper surface of the laminate;
providing a metallic layer grid on the upper surface of the laminate, wherein the metallic layer grid includes a peripheral metallic structure that is peripheral to the component area and substantially encircles the component area;
forming an overmold body fully covering the electronic component and the peripheral metallic structure;
exposing a portion of the top surface of the electronic component by removing a first portion of the overmold body;
exposing a portion of the top surface of the peripheral metallic structure by removing a second portion of the overmold body; and
forming an electromagnetic shield covering the overmold body, wherein the electromagnetic shield contacts the exposed portion of the electronic component and contacts the exposed portion of the peripheral metallic structure, and wherein the electronic component is configured to sink heat directly to the electromagnetic shield through the contacted exposed portion of the electronic component.
4 Assignments
0 Petitions
Accused Products
Abstract
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
157 Citations
22 Claims
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1. A method of manufacturing a module comprising:
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providing a laminate; providing an electronic component on a component area on an upper surface of the laminate; providing a metallic layer grid on the upper surface of the laminate, wherein the metallic layer grid includes a peripheral metallic structure that is peripheral to the component area and substantially encircles the component area; forming an overmold body fully covering the electronic component and the peripheral metallic structure; exposing a portion of the top surface of the electronic component by removing a first portion of the overmold body; exposing a portion of the top surface of the peripheral metallic structure by removing a second portion of the overmold body; and forming an electromagnetic shield covering the overmold body, wherein the electromagnetic shield contacts the exposed portion of the electronic component and contacts the exposed portion of the peripheral metallic structure, and wherein the electronic component is configured to sink heat directly to the electromagnetic shield through the contacted exposed portion of the electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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- 18. The method of 16, further comprising forming a support structure on a bottom surface of the laminate in an area directly below the portion of the peripheral metallic structure which will be exposed.
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22. A method of manufacturing a module comprising:
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a) providing a laminate; b1) providing an electronic component on a component area on an upper surface of the laminate; b2) providing a metallic layer grid on the upper surface of the laminate, wherein the metallic layer grid includes a peripheral metallic structure that is peripheral to the component area and substantially encircles the component area; c) forming an overmold body fully covering the electronic component and the peripheral metallic structure; d1) exposing a portion of the top surface of the electronic component by removing a first portion of the overmold body; d2) exposing a portion of the top surface of the peripheral metallic structure by removing a second portion of the overmold body; and e) forming an electromagnetic shield covering the overmold body, wherein the electromagnetic shield contacts the exposed portion of the electronic component and contacts the exposed portion of the peripheral metallic structure, and wherein the electronic component is configured to sink heat directly to the electromagnetic shield through the contacted exposed portion of the electronic component, and wherein step a) is performed first;
then steps b1) and b2) are performed next in any order or simultaneously;
then step c) is performed;
then steps d1) and d2) are performed next in any order or simultaneously; and
then step e) is performed,wherein the metallic layer grid is provided by providing a metal trace and by providing the peripheral metallic structure directly on top of the metal trace, wherein the peripheral metallic structure includes at least one plating layer or includes at least one surface mount structure, and wherein the peripheral metallic structure is configured to provide electromagnetic shielding around the perimeter of the component area.
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Specification