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Patterning electrode materials free from berm structures for thin film photovoltaic cells

  • US 8,435,822 B2
  • Filed: 12/07/2010
  • Issued: 05/07/2013
  • Est. Priority Date: 09/30/2008
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • providing a substrate having an upper surface and an opposing lower surface;

    forming a first electrode layer overlying the upper surface, the first electrode layer having a first thickness;

    forming one or more patterns in the first electrode layer;

    filling at least one pattern, from the one or more patterns, with a conductive material to form a first interconnect structure having a first height, wherein the first height is substantially equal to the first thickness;

    forming a photovoltaic layer over the first electrode; and

    forming a second electrode layer having a second thickness over the photovoltaic layer.

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