Methods of forming light emitting devices having current reducing structures
First Claim
1. A light emitting device, comprising:
- a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer;
a non-transparent feature on the n-type semiconductor layer opposite the active region; and
a patterned ohmic contact on the p-type semiconductor layer opposite the active region, wherein the patterned ohmic contact is aligned with the non-transparent feature.
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Accused Products
Abstract
A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, and an active region between the n-type semiconductor layer and the p-type semiconductor layer. A non-transparent feature, such as a wire bond pad, is on the p-type semiconductor layer or on the n-type semiconductor layer opposite the p-type semiconductor layer, and a reduced conductivity region is in the p-type semiconductor layer or the n-type semiconductor layer and is aligned with the non-transparent feature. The reduced conductivity region may extend from a surface of the p-type semiconductor layer opposite the n-type semiconductor layer towards the active region and/or from a surface of the n-type semiconductor layer opposite the p-type semiconductor layer towards the active region.
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Citations
54 Claims
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1. A light emitting device, comprising:
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a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer; a non-transparent feature on the n-type semiconductor layer opposite the active region; and a patterned ohmic contact on the p-type semiconductor layer opposite the active region, wherein the patterned ohmic contact is aligned with the non-transparent feature. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A light emitting device, comprising:
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a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer; a non-transparent feature on the n-type semiconductor layer opposite the active region; and an ohmic contact on the p-type semiconductor layer opposite the active region, wherein the ohmic contact exposes a portion of the p-type semiconductor layer that is aligned with the non-transparent feature. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light emitting device, comprising:
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a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer; a non-transparent feature on the n-type semiconductor layer opposite the active region; and an ohmic contact on the p-type semiconductor layer opposite the active region, wherein the ohmic contact includes an opening therein that is aligned with the non-transparent feature. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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22. A light emitting device, comprising:
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a semiconductor diode having first and second opposing semiconductor surfaces of opposite conductivity types; a non-transparent feature on the first semiconductor surface; and a patterned ohmic contact on the second semiconductor surface, wherein the patterned ohmic contact is aligned with the non-transparent feature. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A light emitting device, comprising:
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a semiconductor diode having first and second opposing semiconductor surfaces of opposite conductivity types; a non-transparent feature on the first semiconductor surface; and an ohmic contact on the second semiconductor surface, wherein the ohmic contact exposes a portion of the second semiconductor surface that is aligned with the non-transparent feature. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. A light emitting device, comprising:
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a semiconductor diode having first and second opposing semiconductor surfaces of opposite conductivity types; a non-transparent feature on the first semiconductor surface; and an ohmic contact on the second semiconductor surface, wherein the ohmic contact includes an opening therein that is aligned with the non-transparent feature. - View Dependent Claims (37, 38, 39, 40, 41, 42)
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43. A light emitting device, comprising:
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a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer; a conductive finger on the n-type semiconductor layer opposite the active region; and a patterned ohmic contact on the p-type semiconductor layer opposite the active region, wherein the patterned ohmic contact is aligned with the conductive finger. - View Dependent Claims (44, 45, 46, 47)
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48. A method of fabricating a light emitting device, comprising:
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forming a p-type semiconductor layer, an n-type semiconductor layer and an active region between the n-type semiconductor layer and the p-type semiconductor layer; forming a non-transparent feature on the n-type semiconductor layer opposite the active region; and forming a patterned ohmic contact on the p-type semiconductor layer opposite the active region, wherein the patterned ohmic contact is aligned with the non-transparent feature. - View Dependent Claims (49, 50, 51, 52, 53, 54)
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Specification