Heat-reduction methods and systems related to microfluidic devices
First Claim
1. An integrated microfluidic processing system comprising a microfluidic device, the device comprising:
- a first side;
a second side;
a microfluidic complex comprising a plurality of flow channels, wherein the microfluidic complex is located proximate to the first side of the microfluidic device and distant from the second side of the microfluidic device;
a heating element configured to heat a region of the microfluidic complex, wherein the heating element is located relatively more distant from the first side of the microfluidic device and more proximate to the second side of the microfluidic device than the microfluidic complex; and
at least one conductive lead for supplying electrical current from a current source to the heating element, wherein a portion of the lead extends from a first position within the microfluidic device that is similarly spaced with respect to the first and second sides of the microfluidic device as is the heating element to a second position within the microfluidic device located relatively more distant from the first side of the microfluidic device and more proximate to the second side of the microfluidic device than the heating element.
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Abstract
The present relates to a system and method for preventing or reducing unwanted heat in a microfluidic of the device while generating heat in selected regions of the device. Current can be supplied to a heating element through electric leads that are designed so that the current density in the leads is substantially lower than the current density in the heating element. Unwanted heat in the microfluidic complex can be reduced by thermally isolating the electric leads from the microfluidic complex by, for example, running each lead directly away from the microfluidic complex. Unwanted heat can be removed from selected regions of the microfluidic complex using one or more cooling devices.
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Citations
29 Claims
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1. An integrated microfluidic processing system comprising a microfluidic device, the device comprising:
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a first side; a second side; a microfluidic complex comprising a plurality of flow channels, wherein the microfluidic complex is located proximate to the first side of the microfluidic device and distant from the second side of the microfluidic device; a heating element configured to heat a region of the microfluidic complex, wherein the heating element is located relatively more distant from the first side of the microfluidic device and more proximate to the second side of the microfluidic device than the microfluidic complex; and at least one conductive lead for supplying electrical current from a current source to the heating element, wherein a portion of the lead extends from a first position within the microfluidic device that is similarly spaced with respect to the first and second sides of the microfluidic device as is the heating element to a second position within the microfluidic device located relatively more distant from the first side of the microfluidic device and more proximate to the second side of the microfluidic device than the heating element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An integrated microfluidic processing system comprising a microfluidic device, the microfluidic device comprising:
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a first side; a second side; a microfluidic complex comprising a plurality of flow channels, wherein the microfluidic complex is located proximate to the first side of the microfluidic device and distant from the second side of the microfluidic device; a heating element configured to heat a region of the microfluidic complex, wherein the heating element is located relatively more distant from the first side of the microfluidic device and more proximate to the second side of the microfluidic device than the microfluidic complex; and at least one conductive lead for supplying electrical current from a current source to the heating element, wherein the lead has a lower current density that the heating element. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification