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Pre-plating solutions for making printed circuit boards and methods for preparing the same

  • US 8,440,158 B2
  • Filed: 08/21/2008
  • Issued: 05/14/2013
  • Est. Priority Date: 09/21/2007
  • Status: Active Grant
First Claim
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1. A pre-plating solution for making a printed circuit board, wherein the pre-plating solution consists of:

  • a plurality of carbon nanotubes of 0.01-3 wt % with at least one hydrophilic group located on walls or end portions of one or more of the plurality of carbon nanotubes, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.

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