Pre-plating solutions for making printed circuit boards and methods for preparing the same

• US 8,440,158 B2
• Filed: 08/21/2008
• Issued: 05/14/2013
• Est. Priority Date: 09/21/2007
• Status: Active Grant

• Current Assignee: Hon Hai Precision Industry Co., Ltd., Tsinghua University
• Original Assignee: Hon Hai Precision Industry Co., Ltd., Tsinghua University
• Inventors: Bai, Yao-Wen, Zhang, Rui, Lin, Cheng-Hsien, Lee, Wen-Chin
• Primary Examiner(s): MCCRACKEN, DANIEL
• Application Number:
  US12/195,844
• Publication Number:
  US 20090078578A1
• Time in Patent Office: 1,727 Days
• Field of Search: 4234471-4473, 205/125, 252/502, 977/742
• US Class Current: 423/447.1
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: C23C 18/1204 inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
• CPC Class Codes: C23C 18/127 Preformed particles
• CPC Class Codes: C23C 18/1287 with flow inducing means, e.g. ultrasonic
• CPC Class Codes: H05K 2201/026 Nanotubes or nanowires
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 3/424 by direct electroplating
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates

Abstract

A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.

Claims

1. A pre-plating solution for making a printed circuit board, wherein the pre-plating solution consists of:

a plurality of carbon nanotubes of 0.01-3 wt % with at least one hydrophilic group located on walls or end portions of one or more of the plurality of carbon nanotubes, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.

2. The pre-plating solution as claimed in claim 1, wherein one or more of the carbon nanotubes have a length/diameter ratio of more than 1000:

1.

3. The pre-plating solution as claimed in claim 1, wherein the hydrophilic group is selected from the group consisting of —

COOH, —

COO and —

OH.

4. The pre-plating solution as claimed in claim 1, wherein the surfactant is selected from the group consisting of anionic surfactants and nonionic surfactants.

5. The pre-plating solution as claimed in claim 1, wherein the alkaline substance is selected from the group consisting of sodium hydroxide, potassium hydroxide, ammonium hydroxide and potassium carbonate.

6. The pre-plating solution as claimed in claim 1, wherein a PH value of the pre-plating solution is in an approximate range from 8 to 10.

7. The pre-plating solution as claimed in claim 1, wherein the solvent is de-ionized water.

8. The pre-plating solution as claimed in claim 1, wherein the surfactant is selected from the group consisting of sodium lauryl sulfate and isosorbide dinitrate.

9. The pre-plating solution as claimed in claim 1, wherein the plurality of carbon nanotubes is obtained by chemical vapor deposition, arc discharging, or laser ablation.

10. The pre-plating solution as claimed in claim 1, wherein the plurality of carbon nanotubes is obtained by peeling an array of carbon nanotubes off a substrate.

11. The pre-plating solution as claimed in claim 10, wherein the carbon nanotubes of the array are substantially parallel to each other.