Pre-plating solutions for making printed circuit boards and methods for preparing the same
First Claim
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1. A pre-plating solution for making a printed circuit board, wherein the pre-plating solution consists of:
- a plurality of carbon nanotubes of 0.01-3 wt % with at least one hydrophilic group located on walls or end portions of one or more of the plurality of carbon nanotubes, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.
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Abstract
A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.
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Citations
11 Claims
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1. A pre-plating solution for making a printed circuit board, wherein the pre-plating solution consists of:
- a plurality of carbon nanotubes of 0.01-3 wt % with at least one hydrophilic group located on walls or end portions of one or more of the plurality of carbon nanotubes, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
Specification