Chip quality determination method and marking mechanism using same

• US 8,440,474 B2
• Filed: 07/15/2009
• Issued: 05/14/2013
• Est. Priority Date: 07/22/2008
• Status: Expired due to Fees

• Current Assignee: Ricoh Company Limited
• Original Assignee: Ricoh Company Limited
• Inventors: Yanai, Hirokazu
• Primary Examiner(s): Le, Thao
• Assistant Examiner(s): JONES, ERIC W
• Application Number:
  US13/002,795
• Publication Number:
  US 20110117683A1
• Time in Patent Office: 1,399 Days
• Field of Search: 438 14- 17, 257/E21.525, 702/182, 702/183, 702/185
• US Class Current: 438/14
• CPC Class Codes: G01R 31/2894 Aspects of quality control [QC] G01R31/31718 takes precedence; program control for QC G05B19/41875
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A chip quality determination method includes the steps of (a) determining the continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on the wafer test result of determining the acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in the same defective group; (b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from the periphery of the wafer based on the distance from a corresponding one of the defective groups; and (c) determining the quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.

Claims

1. A chip quality determination method, comprising the steps of:

(a) determining a continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on a wafer test result of determining acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in a same defective group;

(b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from a periphery of the wafer based on a distance from a corresponding one of the defective groups; and

(c) determining a quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.

2. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to one or more of the defective groups determined to be the defective distribution concentration in said step (d).

3. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) selecting one or more of the defective groups having at least one of the defective chips thereof in contact with at least one of the wafer periphery neighboring chips,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (d).

4. The chip quality determination method as claimed in claim 3, further comprising the step of:

(e) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to one or more of the defective groups determined to be the defective distribution concentration in said step (e) and selected in said step (d).

5. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) selecting one or more of the defective groups having at least one of the defective chips thereof located within the predetermined range from the periphery of the wafer,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (d).

6. The chip quality determination method as claimed in claim 5, further comprising the step of:

(e) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to one or more of the defective groups determined to be the defective distribution concentration in said step (e) and selected in said step (d).

7. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) setting, as the determination target wafer periphery neighboring chips, a first one or more of the wafer periphery neighboring chips positioned in a first direction from a first one of the defective chips, the first one of the defective chips being not included in the wafer periphery neighboring chips and being in contact with one of the wafer periphery neighboring chips in the first direction;

a second one or more of the wafer periphery neighboring chips in each of a second direction and a third direction from a second one of the defective chips in each of which directions the second one of the defective chips is in contact with one of the wafer periphery neighboring chips; and

a third one or more of the wafer periphery neighboring chips located between the second and third directions relative to the second one of the defective chips, the second one of the defective chips being not included in the wafer periphery neighboring chips, the second and third directions being along the X-axis and the Y-axis, respectively,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips set in said step (d).

8. The chip quality determination method as claimed in claim 7, further comprising the step of:

(e) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (d) sets the determination target wafer periphery neighboring chips for one or more of the defective groups determined to be the defective distribution concentration in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups determined to be the defective distribution concentration in said step (e).

9. The chip quality determination method as claimed in claim 7, further comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof in contact with at least one of the wafer periphery neighboring chips,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).

10. The chip quality determination method as claimed in claim 9, further comprising the step of:

(f) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (d) sets the determination target wafer periphery neighboring chips for one or more of the defective groups determined to be the defective distribution concentration in said step (f) and selected in step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups determined as the defective distribution concentration in said step (f) and selected in step (e).

11. The chip quality determination method as claimed in claim 7, further comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof located within the predetermined range from the periphery of the wafer,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).

12. The chip quality determination method as claimed in claim 11, further comprising the step of:

(f) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (d) sets the determination target wafer periphery neighboring chips for one or more of the defective groups determined to be the defective distribution concentration in said step (f) and selected in step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups determined to be the defective distribution concentration in said step (f) and selected in step (e).

13. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) setting, as the determination target wafer periphery neighboring chips, a first one or more of the wafer periphery neighboring chips in at least one of a first direction and a second direction from one of the defective chips and a second one or more of the wafer periphery neighboring chips in a third direction inclined at 45 degrees to one of the first and second directions, the one of the defective chips being not included in the wafer periphery neighboring chips and in contact therewith in the at least one of the first and second directions, the first and second directions being along the X-axis and the Y-axis, respectively,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips set in said step (d).

14. The chip quality determination method as claimed in claim 13, further comprising the step of:

(e) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (d) sets the determination target wafer periphery neighboring chips for one or more of the defective groups determined to be the defective distribution concentration in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups determined to be the defective distribution concentration in said step (e).

15. The chip quality determination method as claimed in claim 13, further comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof in contact with at least one of the wafer periphery neighboring chips,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).

16. The chip quality determination method as claimed in claim 13, thither comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof located within the predetermined range from the periphery of the wafer,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).

17. The chip quality determination method as claimed in claim 1, further comprising the step of:

(d) setting, as the determination target wafer periphery neighboring chips, one or more of the wafer periphery neighboring chips located within a predetermined range from one of the defective chips,

wherein said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips set in said step (d).

18. The chip quality determination method as claimed in claim 17, further comprising the step of:

(e) comparing, with respect to each of the defective groups, a number of defective chips thereof with a preset threshold and determining the defective group to be a defective distribution concentration in response to the number of defective chips being more than or equal to the threshold,

wherein said step (d) sets the determination target wafer periphery neighboring chips for one or more of the defective groups determined to be the defective distribution concentration in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups determined to be the defective distribution concentration in said step (e).

19. The chip quality determination method as claimed in claim 17, further comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof in contact with at least one of the wafer periphery neighboring chips,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).

20. The chip quality determination method as claimed in claim 17, further comprising the step of:

(e) selecting one or more of the defective groups having at least one of the defective chips thereof located within the predetermined range from the periphery of the wafer,

wherein said step (d) sets the determination target wafer periphery neighboring chips for the one or more of the defective groups selected in said step (e), and

said step (b) calculates the quality determination index of each of the determination target wafer periphery neighboring chips with respect to the one or more of the defective groups selected in said step (e).