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Chip quality determination method and marking mechanism using same

  • US 8,440,474 B2
  • Filed: 07/15/2009
  • Issued: 05/14/2013
  • Est. Priority Date: 07/22/2008
  • Status: Expired due to Fees
First Claim
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1. A chip quality determination method, comprising the steps of:

  • (a) determining a continuity of defective chips in at least four directions of an X-axis and a Y-axis on a wafer based on a wafer test result of determining acceptability of chips arranged in a matrix in the four directions on the wafer, and dividing the defective chips into one or more defective groups so that successive ones of the defective chips are in a same defective group;

    (b) calculating a quality determination index of each of one or more determination target wafer periphery neighboring chips among wafer periphery neighboring chips located within a predetermined range from a periphery of the wafer based on a distance from a corresponding one of the defective groups; and

    (c) determining a quality of the determination target wafer periphery neighboring chips by comparing the quality determination indexes thereof with a preset threshold.

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