Method and structure for forming module using a powder coating and thermal treatment process
First Claim
1. A method of forming a solar module, the method comprising:
- providing a substrate member having a surface region;
forming a photovoltaic film overlying the surface region, the photovoltaic film comprising one or more layers of N-type photosensitive semiconductor material alternatively and respectively overlying one or more layers of P-type photosensitive semiconductor material;
forming a barrier layer overlying and enclosing the photovoltaic film on the top and side surfaces;
forming a powder coating overlying the barrier layer and enclosing the photovoltaic film to protect the photovoltaic film, wherein the powder coating consists of a tetrafluorooxetane fluorine-doped SnO2;
performing a thermal treatment process to cure the powder coating; and
sealing with an encapsulating material over the powder coating wherein the barrier layer comprises SiN, or SiO2, or TiN, or TFO.
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Abstract
The present invention provides a solar module formed using a powder coating and thermal treatment process. The solar module includes a substrate having a surface region and a photovoltaic material overlying the surface region. The solar module further includes a barrier material overlying the photovoltaic material. Moreover, the solar module includes a coating overlying the barrier material and enclosing the photovoltaic material to mechanically protect the photovoltaic material. In certain embodiments, photovoltaic material is a thin film photovoltaic cell and the coating is provided by a powder coating substantially free of bubbles formed by electrostatic spraying and cured with a thermal treatment process.
104 Citations
8 Claims
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1. A method of forming a solar module, the method comprising:
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providing a substrate member having a surface region; forming a photovoltaic film overlying the surface region, the photovoltaic film comprising one or more layers of N-type photosensitive semiconductor material alternatively and respectively overlying one or more layers of P-type photosensitive semiconductor material; forming a barrier layer overlying and enclosing the photovoltaic film on the top and side surfaces; forming a powder coating overlying the barrier layer and enclosing the photovoltaic film to protect the photovoltaic film, wherein the powder coating consists of a tetrafluorooxetane fluorine-doped SnO2; performing a thermal treatment process to cure the powder coating; and sealing with an encapsulating material over the powder coating wherein the barrier layer comprises SiN, or SiO2, or TiN, or TFO. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification