Cu pillar bump with non-metal sidewall protection structure

• US 8,441,124 B2
• Filed: 04/29/2010
• Issued: 05/14/2013
• Est. Priority Date: 04/29/2010
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wu, Yi-Wen, Lin, Cheng-Chung, Hwang, Chien Ling, Liu, Chung-Shi
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US12/769,768
• Publication Number:
  US 20110266667A1
• Time in Patent Office: 1,111 Days
• Field of Search: 257/737, 257/778, 257/762, 257/781, 257/E23.021
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/0345 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05023 the whole internal layer protruding from the surface
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05181 Tantalum [Ta] as principal constituent
• CPC Class Codes: H01L 2224/05187 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/05541 Structure
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05582 Two-layer coating
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05671 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05681 Tantalum [Ta] as principal constituent
• CPC Class Codes: H01L 2224/05687 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/10145 Flow barriers
• CPC Class Codes: H01L 2224/11 : Manufacturing methods
• CPC Class Codes: H01L 2224/11002 : for supporting the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/1112 : Applying permanent coating
• CPC Class Codes: H01L 2224/1132 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/1145 : Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/11452 : Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/11462 : Electroplating
• CPC Class Codes: H01L 2224/11464 : Electroless plating
• CPC Class Codes: H01L 2224/1147 : using a lift-off mask
• CPC Class Codes: H01L 2224/11827 : Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/11831 : involving a chemical process, e.g. etching the bump connector
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/11912 : the bump being used as a mask for patterning other parts
• CPC Class Codes: H01L 2224/13005 : Structure
• CPC Class Codes: H01L 2224/13007 : Bump connector smaller than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13023 : the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/13083 : Three-layer arrangements
• CPC Class Codes: H01L 2224/13109 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13113 : Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/13116 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13118 : Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/1312 : Antimony [Sb] as principal constituent
• CPC Class Codes: H01L 2224/13123 : Magnesium [Mg] as principal constituent
• CPC Class Codes: H01L 2224/13124 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13164 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/13166 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1317 : Zirconium [Zr] as principal constituent
• CPC Class Codes: H01L 2224/13171 : Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/13181 : Tantalum [Ta] as principal constituent
• CPC Class Codes: H01L 2224/13551 : being non uniform
• CPC Class Codes: H01L 2224/13561 : On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13565 : Only outside the bonding interface of the bump connector
• CPC Class Codes: H01L 2224/1357 : Single coating layer
• CPC Class Codes: H01L 2224/1358 : being stacked
• CPC Class Codes: H01L 2224/13582 : Two-layer coating
• CPC Class Codes: H01L 2224/13644 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13647 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13664 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/13686 : with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/13687 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/13688 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/1369 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81192 : wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/814 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3841 : Solder bridging

Abstract

A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.

Claims

1. An integrated circuit device, comprising:

a semiconductor substrate;

a conductive pillar formed over the semiconductor substrate, and having a sidewall surface and a top surface;

a under-bump-metallurgy (UBM) layer formed between the semiconductor substrate and the conductive pillar, and having a surface region adjacent to and extending from the sidewall surface of the conductive pillar; and

a protection structure formed on the sidewall surface of the conductive pillar and the surface region of the UBM layer;

wherein the protection structure is formed of a non-metal material, and the conductive pillar is formed of a copper-containing layer.

2. The integrated circuit device of claim 1, wherein the protection structure comprises a silicon nitride layer.

3. The integrated circuit device of claim 1, wherein the protection structure comprises a polyimide layer.

4. The integrated circuit device of claim 1, wherein the protection structure comprises at least one of a dielectric layer, a polymer layer, or combinations thereof.

5. The integrated circuit device of claim 1, wherein the UBM layer comprises a first UBM layer formed on the semiconductor substrate, and a second UBM layer formed on the first UBM layer, and wherein the first UBM layer and the second UBM layer have the same size.

6. The integrated circuit device of claim 1, further comprising a barrier layer formed between the UBM layer and the protection structure, wherein the barrier layer is a copper-containing material layer comprising Ge, Si, N, or combinations thereof.

7. The integrated circuit device of claim 1, further comprising a barrier layer formed between the conductive pillar and the protection structure, wherein the barrier layer is a copper-containing material layer comprising Ge, Si, N, or combinations thereof.

8. The integrated circuit device of claim 1, further comprising a cap layer on the top surface of the conductive pillar.

9. The integrated circuit device of claim 8, wherein the cap layer comprises a Ni layer on the top surface of the conductive pillar, and an Au layer on the Ni layer.

10. The integrated circuit device of claim 8, further comprising a solder layer formed on the cap layer.

11. The integrated circuit device of claim 10, wherein the protection structure extends to cover at least a portion of the sidewall surface of the cap layer and the sidewall surface of the solder layer.

12. The integrated circuit device of claim 8, wherein the protection structure extends to cover at least a portion of the sidewall surface of the cap layer.

13. A packaging assembly, comprising:

a first substrate;

a bump structure formed on the first substrate,

wherein the bump structure comprises an under-bump-metallurgy (UBM) layer formed on the first substrate, and a copper pillar formed on the UBM layer,

wherein the UBM layer has a surface region adjacent to and extending from a sidewall surface of the copper pillar;

a non-metal protection structure covering the sidewall surface of the copper pillar and the surface region of the UBM layer;

a second substrate; and

a joint solder layer formed between the second substrate and the bump structure.

14. The packaging assembly of claim 13, wherein the non-metal protection structure comprises a silicon nitride layer.

15. The packaging assembly of claim 13, wherein the non-metal protection structure comprises a polyimide layer.

16. The packaging assembly of claim 13, wherein the non-metal protection structure comprises at least one of a dielectric layer, a polymer layer, or combinations thereof.

17. The packaging assembly of claim 13, further comprising a barrier layer formed among the UBM layer, the non-metal protection structure and the copper pillar, wherein the barrier layer is a copper-containing material layer comprising Ge, Si, N, or combinations thereof.

18. The packaging assembly of claim 13, further comprising a cap layer on a top surface of the copper pillar.

19. The packaging assembly of claim 18, wherein the cap layer comprises a Ni layer on the top surface of the copper pillar, and an Au layer on the Ni layer.

20. The packaging assembly of claim 18, further comprising a solder layer formed on the cap layer.