Substrate placement in immersion lithography
First Claim
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1. A method for loading a substrate in a depression of a chuck, the method comprising:
- loading the substrate onto a substrate handler;
determining an offset of a center of the substrate with respect to a center of the depression;
shifting a position of the substrate by an offset to correct for the offset of a center of the substrate with respect to the center of the depression to allow the substrate to enter inside the depression without colliding with a surface of the chuck or an edge of the depression in the chuck, andplacing the substrate substantially centered into the depression.
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Abstract
A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.
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Citations
12 Claims
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1. A method for loading a substrate in a depression of a chuck, the method comprising:
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loading the substrate onto a substrate handler; determining an offset of a center of the substrate with respect to a center of the depression; shifting a position of the substrate by an offset to correct for the offset of a center of the substrate with respect to the center of the depression to allow the substrate to enter inside the depression without colliding with a surface of the chuck or an edge of the depression in the chuck, and placing the substrate substantially centered into the depression. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification