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Substrate placement in immersion lithography

  • US 8,441,617 B2
  • Filed: 11/03/2011
  • Issued: 05/14/2013
  • Est. Priority Date: 12/10/2004
  • Status: Expired due to Fees
First Claim
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1. A method for loading a substrate in a depression of a chuck, the method comprising:

  • loading the substrate onto a substrate handler;

    determining an offset of a center of the substrate with respect to a center of the depression;

    shifting a position of the substrate by an offset to correct for the offset of a center of the substrate with respect to the center of the depression to allow the substrate to enter inside the depression without colliding with a surface of the chuck or an edge of the depression in the chuck, andplacing the substrate substantially centered into the depression.

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