Device for stripping a wafer from a carrier
First Claim
1. Device for stripping a wafer from a carrier, wherein the carrier is fixed to the wafer by an interconnect layer that provides a connection between the carrier and the wafer, said device comprising:
- a receiving means for receiving a carrier-wafer combination comprised of the carrier and the wafer, said interconnect layer providing the connection between the carrier and the wafer at a peripheral edge of the carrier-wafer combination;
a connection release means for unfixing the connection between the carrier and the wafer, said connection release means having at least one release device that includes;
a working chamber for surrounding at least a portion of the peripheral edge of the carrier-wafer combination, andmeans for delivering a solvent to the working chamber, said solvent for dissolving the interconnect layer;
a rotation means for rotating the carrier-wafer combination to move the peripheral edge of the carrier-wafer combination through the working chamber of the connection release means to contact the peripheral edge of the carrier-wafer combination with the solvent, thereby dissolving the interconnect layer at the peripheral edge and breaking the connection between the carrier and the wafer; and
stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer.
1 Assignment
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Accused Products
Abstract
Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
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Citations
23 Claims
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1. Device for stripping a wafer from a carrier, wherein the carrier is fixed to the wafer by an interconnect layer that provides a connection between the carrier and the wafer, said device comprising:
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a receiving means for receiving a carrier-wafer combination comprised of the carrier and the wafer, said interconnect layer providing the connection between the carrier and the wafer at a peripheral edge of the carrier-wafer combination; a connection release means for unfixing the connection between the carrier and the wafer, said connection release means having at least one release device that includes; a working chamber for surrounding at least a portion of the peripheral edge of the carrier-wafer combination, and means for delivering a solvent to the working chamber, said solvent for dissolving the interconnect layer; a rotation means for rotating the carrier-wafer combination to move the peripheral edge of the carrier-wafer combination through the working chamber of the connection release means to contact the peripheral edge of the carrier-wafer combination with the solvent, thereby dissolving the interconnect layer at the peripheral edge and breaking the connection between the carrier and the wafer; and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. Device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination, said device comprising:
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a stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer; a rotation means for rotation of the carrier-wafer combination in a release position; and a connection release means including; a working chamber in which at least a section of the peripheral edge of the carrier-wafer combination can be accommodated in the working chamber, and means for delivering a solvent to the working chamber, said solvent for dissolving the interconnect layer at the peripheral edge of the carrier-wafer combination. - View Dependent Claims (20, 21, 22, 23)
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Specification