Spin-on protective coatings for wet-etch processing of microelectronic substrates

• US 8,445,591 B2
• Filed: 01/30/2012
• Issued: 05/21/2013
• Est. Priority Date: 09/13/2007
• Status: Active Grant

• Current Assignee: Brewer Science Inc.
• Original Assignee: Brewer Science Inc.
• Inventors: Xu, Gu, Yess, Kimberly A., Flaim, Tony D.
• Primary Examiner(s): SELLERS, ROBERT E
• Application Number:
  US13/361,556
• Publication Number:
  US 20120130004A1
• Time in Patent Office: 477 Days
• Field of Search: None
• US Class Current: 525/122
• CPC Class Codes: B81C 1/00801 Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer B81C1/00595, B81C1/00468 take precedence
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 63/04 Epoxynovolacs
• CPC Class Codes: C09D 125/12 with unsaturated nitriles
• CPC Class Codes: H01L 21/0271 comprising organic layers
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31663 As siloxane, silicone or silane

Abstract

New protective coating layers for use in wet etch processes during the production of semiconductor and MEMS devices are provided. The layers include a primer layer, a first protective layer, and an optional second protective layer. The primer layer preferably comprises an organo silane compound in a solvent system. The first protective layer includes thermoplastic copolymers prepared from styrene, acrylonitrile, and compatible compounds such as monomers, oligomers, and polymers comprising epoxy groups; poly(styrene-co-allyl alcohol); and mixtures thereof. The second protective layer comprises a highly halogenated polymer such as a chlorinated polymer to which may or may not be crosslinked upon heating.

Claims

1. A composition useful as a protective layer, said composition comprising a first polymer and a compatible compound dissolved or dispersed in a solvent system, wherein:

said first polymer comprises;

2. The composition of claim 1, wherein said compatible compound is selected from the group consisting of epoxy phenol novolac resins, epoxy bisphenol A/F resins, epoxy cresol novolac resins, epoxy bisphenol A resins, and epoxy bisphenol A novolac resins.

3. The composition of claim 1, wherein said compatible compound comprises from about 15% to about 30% by weight epoxy groups, based upon the total weight of the compatible compound taken as 100% by weight.