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LED package having an array of light emitting cells coupled in series

  • US 8,445,933 B2
  • Filed: 05/18/2010
  • Issued: 05/21/2013
  • Est. Priority Date: 03/11/2005
  • Status: Expired due to Fees
First Claim
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1. A light emitting diode (LED) package, comprising:

  • a heat sink;

    an LED chip arranged on a chip mounting portion of the heat sink;

    at least two lead frames spaced apart from the heat sink; and

    a package body coupled with the heat sink and the at least two lead frames,wherein the chip mounting portion of the heat sink and at least a portion of the at least two lead frames are exposed from a top side of the package body, and a base of the heat sink is exposed from a bottom side of the package body,wherein the heat sink comprises a protrusion, and the chip mounting portion is recessed below the protrusion,wherein the heat sink further comprises a latching step, and the latching step is arranged above the chip mounting portion, andwherein the latching step protrudes from a side surface of the protrusion.

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