LED package having an array of light emitting cells coupled in series
First Claim
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1. A light emitting diode (LED) package, comprising:
- a heat sink;
an LED chip arranged on a chip mounting portion of the heat sink;
at least two lead frames spaced apart from the heat sink; and
a package body coupled with the heat sink and the at least two lead frames,wherein the chip mounting portion of the heat sink and at least a portion of the at least two lead frames are exposed from a top side of the package body, and a base of the heat sink is exposed from a bottom side of the package body,wherein the heat sink comprises a protrusion, and the chip mounting portion is recessed below the protrusion,wherein the heat sink further comprises a latching step, and the latching step is arranged above the chip mounting portion, andwherein the latching step protrudes from a side surface of the protrusion.
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Abstract
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
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Citations
18 Claims
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1. A light emitting diode (LED) package, comprising:
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a heat sink; an LED chip arranged on a chip mounting portion of the heat sink; at least two lead frames spaced apart from the heat sink; and a package body coupled with the heat sink and the at least two lead frames, wherein the chip mounting portion of the heat sink and at least a portion of the at least two lead frames are exposed from a top side of the package body, and a base of the heat sink is exposed from a bottom side of the package body, wherein the heat sink comprises a protrusion, and the chip mounting portion is recessed below the protrusion, wherein the heat sink further comprises a latching step, and the latching step is arranged above the chip mounting portion, and wherein the latching step protrudes from a side surface of the protrusion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification