LED package having an array of light emitting cells coupled in series

• US 8,445,933 B2
• Filed: 05/18/2010
• Issued: 05/21/2013
• Est. Priority Date: 03/11/2005
• Status: Expired due to Fees

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Chung Hoon, Lee, Keon Young, Kim, Hong San, Kim, Dae Won, Choi, Hyuck Jung
• Primary Examiner(s): Tran, Tran
• Application Number:
  US12/782,287
• Publication Number:
  US 20100224904A1
• Time in Patent Office: 1,099 Days
• Field of Search: 257/79, 257/88, 257 98-100, 257/E33.066, 257/E33.075, 257/E33.059
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light emitting diode (LED) package, comprising:

a heat sink;

an LED chip arranged on a chip mounting portion of the heat sink;

at least two lead frames spaced apart from the heat sink; and

a package body coupled with the heat sink and the at least two lead frames,

wherein the chip mounting portion of the heat sink and at least a portion of the at least two lead frames are exposed from a top side of the package body, and a base of the heat sink is exposed from a bottom side of the package body,

wherein the heat sink comprises a protrusion, and the chip mounting portion is recessed below the protrusion,

wherein the heat sink further comprises a latching step, and the latching step is arranged above the chip mounting portion, and

wherein the latching step protrudes from a side surface of the protrusion.

2. The LED package of claim 1, wherein the at least two lead frames are arranged on and spaced apart from an upper surface of the heat sink.

3. The LED package of claim 1, wherein the latching step is configured to prevent the heat sink from being separated from the package body.

4. The LED package of claim 1, wherein the latching step is arranged on a side surface of the heat sink protrusion.

5. The LED package of claim 3, wherein the latching step is arranged on a side surface of the base of the heat sink.

6. The LED package of claim 1, wherein each lead frame comprises an inner frame and an outer frame extending from the inner frame in a first direction and protruding to the outside of the package body.

7. The LED package of claim 6, wherein each outer frame protrudes to the outside of the package body through a side surface of the package body.

8. The LED package of claim 1, further comprising:

a molding member arranged on a top portion of the LED chip.

9. The LED package of claim 8, wherein the molding member comprises a first molding member adjacent to the LED chip and a second molding member spaced apart from the LED chip.

10. The LED package of claim 9, wherein the second molding member has a hardness value larger than that of the first molding member.

11. The LED package of claim 6, wherein the inner frames of the at least two lead frames are arranged to form a symmetric structure to define a hollow portion at a central position between the inner frames.

12. The LED package of claim 6, wherein each lead frame further comprises a support extending from the inner frame in a second direction substantially perpendicular to the first direction.

13. The LED package of claim 1, wherein a top surface of the protrusion and a top surface of the lead frames are coplanar.

14. The LED package of claim 1, wherein the package body comprises a stepped portion.

15. The LED package of claim 1, wherein the package body comprises a first package body and a second package body that is not integrally formed with the first package body.

16. The LED package of claim 1, wherein the package body is integrally formed.

17. The LED package of claim 1, wherein the latching step is inserted into a groove in the package body.

18. The LED package of claim 15, wherein a first stepped portion and a second stepped portion are arranged in an inner wall of the first package body.