Semiconductor device bonding with stress relief connection pads
First Claim
1. A semiconductor device, comprising:
- a semiconductor chip;
an internal pad provided on a surface of the semiconductor chip for electrical connection;
a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed;
a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed;
a bump underlying layer that covers the internal pad, an interior surface of the opening portion of the stress relief layer and a surface of the stress relief layer around the opening portion;
a connection pad made of copper, the connection pad including a copper anchor buried in the pad opening and the opening portion and connected to the internal pad via the bump underlying layer, and a copper projection provided integrally with the anchor and projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion and a width of the internal pad, the projection being opposed to the surface of the stress relief layer via the bump underlying layer, the projection having a distal surface that faces away from the stress relief layer, and which has a first portion disposed directly aligned with the anchor and a second portion over the stress relief layer, the first portion and the second portion collectively defining the entire distal surface of the projection as being flat and being at a common level, the distal surface and a side surface of the projection being rough; and
a metal ball provided for external electrical connection and covering the projection of the connection pad.
1 Assignment
0 Petitions
Accused Products
Abstract
An inventive semiconductor device includes: a semiconductor chip; an internal pad provided on a surface of the semiconductor chip for electrical connection; a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed; a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed; a connection pad including an anchor buried in the pad opening and the opening portion and connected to the internal pad, and a projection provided integrally with the anchor as projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion; and a metal ball provided for external electrical connection as covering the projection of the connection pad.
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Citations
4 Claims
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1. A semiconductor device, comprising:
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a semiconductor chip; an internal pad provided on a surface of the semiconductor chip for electrical connection; a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed; a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed; a bump underlying layer that covers the internal pad, an interior surface of the opening portion of the stress relief layer and a surface of the stress relief layer around the opening portion; a connection pad made of copper, the connection pad including a copper anchor buried in the pad opening and the opening portion and connected to the internal pad via the bump underlying layer, and a copper projection provided integrally with the anchor and projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion and a width of the internal pad, the projection being opposed to the surface of the stress relief layer via the bump underlying layer, the projection having a distal surface that faces away from the stress relief layer, and which has a first portion disposed directly aligned with the anchor and a second portion over the stress relief layer, the first portion and the second portion collectively defining the entire distal surface of the projection as being flat and being at a common level, the distal surface and a side surface of the projection being rough; and a metal ball provided for external electrical connection and covering the projection of the connection pad. - View Dependent Claims (2, 3, 4)
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Specification