Sensor system and method for producing a sensor system

• US 8,448,512 B2
• Filed: 11/11/2008
• Issued: 05/28/2013
• Est. Priority Date: 12/27/2007
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Jocham, Reinhold, Kurle, Juergen, Schmich, Franz
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US12/734,687
• Publication Number:
  US 20110041602A1
• Time in Patent Office: 1,659 Days
• Field of Search: 734/93, 735/040.2, 735/041.2, 735/140.1, 735/141.4, 738/665
• US Class Current: 73/493
• CPC Class Codes: G01C 19/00 Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A sensor system is provided having a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension; the support frame being fastened in the recess; the damping element being situated between the support frame and the recess; and the sensor module further being pressed into the support frame in a form-locking and a force-locking manner.

Claims

1. A sensor system comprising:

a base plate, a sensor module, a damping element and a support frame, the base plate having a main plane of extension and a recess that is perpendicular to the main plane of extension;

the support frame being fastened in the recess; and

the damping element being situated between the support frame and the recess,

wherein the sensor module is pressed into the support frame in a form-locking and a force-locking manner.

2. The sensor system as recited in claim 1, wherein the sensor module has at least one terminal pin, which has a connection surface, outside the sensor module, that is essentially parallel to the main plane of extension.

3. The sensor system as recited in claim 2, wherein the terminal pin includes a standard pin, the standard pin having a head situated outside the sensor module.

4. The sensor system as recited in claim 2, wherein the connection surface is contacted electrically conductively using a bonding wire.

5. The sensor system as recited in claim 4, wherein the terminal pin has an additional connection surface which is contacted electrically conductively using an additional bonding wire.

6. The sensor system as recited in claim 5, wherein the additional connection surface is situated within the sensor module.

7. The sensor system as recited in claim 1, wherein the damping element includes a silicone.

8. The sensor system as recited in claim 7, wherein the silicone is sprayed between the support frame and the base plate.

9. The sensor system as recited in claim 1, wherein elastic properties of the damping element are essentially constant from 125 degrees Celsius to minus 30 degrees Celsius.

10. The sensor system as recited in claim 9, wherein the elastic properties of the damping element are essentially constant from 125 degrees Celsius to minus 50 degrees Celsius.

11. The sensor system as recited in claim 9, wherein the elastic properties of the damping element are essentially constant from 125 degrees Celsius to minus 40 degrees Celsius.

12. The sensor system as recited in claim 1, wherein at least one of an extension of the base plate perpendicular to the main plane of extension and an extension of the support frame perpendicular to the main plane of extension overlaps the extension of the sensor module in a direction parallel to the main plane of extension at least to an extent of 40%.

13. The sensor system as recited in claim 1, wherein at least one of an extension of the base plate perpendicular to the main plane of extension and an extension of the support frame perpendicular to the main plane of extension overlaps the extension of the sensor module in a direction parallel to the main plane of extension at least to an extent of 70%.

14. The sensor system as recited in claim 1, wherein at least one of an extension of the base plate perpendicular to the main plane of extension and an extension of the support frame perpendicular to the main plane of extension overlaps the extension of the sensor module in a direction parallel to the main plane of extension at least to an extent of 90%.

15. The sensor system as recited in claim 1, wherein the sensor system has an overall extension, perpendicular to the main plane of extension, of at most 10 mm.

16. The sensor system as recited in claim 1, wherein the sensor system has an overall extension, perpendicular to the main plane of extension, of at most 6 mm.

17. The sensor system as recited in claim 1, wherein the sensor system has an overall extension, perpendicular to the main plane of extension, of at most 5.5 mm.

18. The sensor system as recited in claim 1, wherein the sensor module includes a hermetically sealed welded metal housing, and the support frame includes an aluminum frame.

19. The sensor system as recited in claim 1, wherein the sensor module includes a rotation rate sensor.

20. A method for producing a sensor system as recited in claim 1, comprising:

inserting the support frame into the recess;

spraying the damping element between the recess and the support frame; and

pressing the sensor module into the support frame.

21. A method for producing a sensor system as recited in claim 2, comprising:

inserting the support frame into the recess;

spraying the damping element between the recess and the support frame;

pressing the sensor module into the support frame; and

electrically contacting the connection surface of the at least one terminal pin using a bonding wire to a component that is situated on the base plate.

22. The method as recited in claim 21, wherein prior to inserting the support frame into the recess, an additional connection surface lying opposite the connection surface along the terminal pin is electrically contacted by an additional bonding wire.