Smart card module with flip-chip-mounted semiconductor chip
First Claim
Patent Images
1. A smart card module comprising:
- a base material with at least one metal layer;
a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer;
an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer; and
an antenna coil that is disposed over the at least one metal layer.
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Accused Products
Abstract
A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.
17 Citations
23 Claims
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1. A smart card module comprising:
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a base material with at least one metal layer; a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer; and an antenna coil that is disposed over the at least one metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A smart card module comprising:
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a base material with at least one metal layer; a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer; and a second metal layer applied to a non-metallized side of the base material. - View Dependent Claims (9, 10, 11)
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12. A smart card module comprising:
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a base material having a first side and a second side; a first metal layer disposed over the first side of the base material; a semiconductor chip disposed over the first metal layer, the semiconductor chip having a plurality of contacts electrically connected to the first metal layer; an encapsulation layer disposed over the semiconductor chip; and a second metal layer disposed over the encapsulation layer.
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13. A smart card module comprising:
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a base material having a first side and a second side; a first metal layer disposed over the first side of the base material; a semiconductor chip disposed over the first metal layer, the semiconductor chip having a plurality of contacts electrically connected to the first metal layer; an encapsulation layer disposed over the semiconductor chip; and a third metal layer disposed over the second side of the base material. - View Dependent Claims (14)
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15. A method for producing a smart card module comprising:
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providing a base material with at least one metal layer; disposing a semiconductor chip having a plurality of contacts over the at least one metal layer of the base material; encapsulating the semiconductor chip and at least a portion of the at least one metal layer and the base material with an encapsulation layer; and disposing a second metal layer over the encapsulation layer. - View Dependent Claims (16)
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17. A method for producing a smart card module comprising:
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providing a base material with at least one metal layer; disposing a semiconductor chip having a plurality of contacts over the at least one metal layer of the base material; and encapsulating the semiconductor chip and at least a portion of the at least one metal layer and the base material with an encapsulation layer; wherein disposing the semiconductor chip over the at least one metal layer comprises soldering a plurality of contact bumps between the plurality of contacts and the at least one metal layer, or disposing an adhesive layer between the at least one metal layer and semiconductor chip. - View Dependent Claims (18)
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19. A method for producing a smart card module comprising:
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providing a base material with at least one metal layer; disposing a semiconductor chip having a plurality of contacts over the at least one metal layer of the base material; and encapsulating the semiconductor chip and at least a portion of the at least one metal layer and the base material with an encapsulation layer; disposing a third metal layer over a non-metallic side of the base material; and connecting the third metal layer with the at least one metal layer through a plurality of through connections.
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20. A smart card module comprising:
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a base material with at least one metal layer; a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; and an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer, wherein the encapsulation layer is a resin coated copper foil.
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21. A smart card module comprising:
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a base material with at least one metal layer, wherein the base material comprises epoxy resin and glass fiber fabric; a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; and an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer. - View Dependent Claims (22)
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23. A smart card module comprising:
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a base material with at least one metal layer; a semiconductor chip disposed over the base material, the semiconductor chip having a contact side with a plurality of contacts, wherein the plurality of contacts are electrically connected to the at least one metal layer; an encapsulating layer disposed over the semiconductor chip and at least a portion of the base material and the at least one metal layer; and an adhesive layer disposed between the contact side of the semiconductor chip and the base material.
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Specification