Method of reducing floating body effect of SOI MOS device via a large tilt ion implantation
First Claim
1. A method of reducing floating body effect of partially depleted (PD) SOI MOS device via a large tilt ion implantation comprising a step of:
- (a) implanting P-type ions in an inclined direction into an NMOS including a buried insulation layer, a highly doped N-type source region and a highly doped N-type drain region, to form a highly doped P region under the source region but not the drain region of the NMOS and above the buried insulation layer, thereby a PN junction under the source region but not the drain region for reducing floating body effect of PD SOI MOS device is formed;
wherein the angle between a longitudinal line of the NMOS and the inclined direction is ranging from 15 to 45 degrees.
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Abstract
The present invention discloses a method of reducing floating body effect of SOI MOS device via a large tilt ion implantation including a step of: (a) implanting ions in an inclined direction into an NMOS with a buried insulation layer forming a highly doped P region under a source region of the NMOS and above the buried insulation layer, wherein the angle between a longitudinal line of the NMOS and the inclined direction is ranging from 15 to 45 degrees. Through this method, the highly doped P region under the source region and a highly doped N region form a tunnel junction so as to reduce the floating body effect. Furthermore, the chip area will not be increased, manufacturing process is simple and the method is compatible with conventional CMOS process.
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12 Claims
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1. A method of reducing floating body effect of partially depleted (PD) SOI MOS device via a large tilt ion implantation comprising a step of:
- (a) implanting P-type ions in an inclined direction into an NMOS including a buried insulation layer, a highly doped N-type source region and a highly doped N-type drain region, to form a highly doped P region under the source region but not the drain region of the NMOS and above the buried insulation layer, thereby a PN junction under the source region but not the drain region for reducing floating body effect of PD SOI MOS device is formed;
wherein the angle between a longitudinal line of the NMOS and the inclined direction is ranging from 15 to 45 degrees. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- (a) implanting P-type ions in an inclined direction into an NMOS including a buried insulation layer, a highly doped N-type source region and a highly doped N-type drain region, to form a highly doped P region under the source region but not the drain region of the NMOS and above the buried insulation layer, thereby a PN junction under the source region but not the drain region for reducing floating body effect of PD SOI MOS device is formed;
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