Light emitting package structure

• US 8,450,770 B2
• Filed: 05/11/2010
• Issued: 05/28/2013
• Est. Priority Date: 05/11/2010
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Jeong, Hyunsoo, Lee, Seongoo, Park, Ryungshik, Lee, Hyunil
• Primary Examiner(s): Toledo, Fernando L
• Assistant Examiner(s): KUSUMAKAR, KAREN M
• Application Number:
  US12/777,525
• Publication Number:
  US 20110278610A1
• Time in Patent Office: 1,113 Days
• Field of Search: 438/26, 438/29, 438/33, 438/116, 438/127, 257/81, 257/98, 257/99, 257/100, 257/433, 257/434, 257/795
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.

Claims

1. A light emitting diode (LED) package structure, comprising:

a carrier;

an LED chip disposed on the carrier, the LED chip having at least one electrode;

a first encapsulant disposed on the carrier and covering the LED chip, the first encapsulant being provided with at least one opening exposing at least a portion of the at least one electrode;

at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance;

a plurality of phosphor particles distributed within the first encapsulant; and

a second encapsulant, disposed on the carrier and encapsulating the LED chip, the first encapsulant and the at least one bonding wire.

2. The LED package structure according to claim 1, wherein the first encapsulant covers the entire LED chip except the exposed portion of the at least one electrode and a bottom surface of the LED chip facing the carrier.

3. The LED package structure according to claim 1, wherein a bottom surface of the LED chip is coplanar with a bottom surface of the first encapsulant.

4. The LED package structure according to claim 1, wherein the carrier has a cavity accommodating the LED chip.

5. The LED package structure according to claim 4, wherein the cavity is filled with the second encapsulant, while a top surface of the second encapsulant is coplanar with a top surface of the carrier surrounding the cavity.

6. The LED package structure according to claim 1, wherein the carrier comprises a metal leadframe, a pre-molded metal leadframe or a circuit substrate.

7. The LED package structure according to claim 1, wherein the LED chip has a first electrode and a second electrode both disposed on a top surface of the LED chip, while the first electrode and the second electrode are respectively electrically connected to the carrier via a first bonding wire and a second bonding wire.

8. A light emitting diode (LED) package structure, comprising:

a carrier;

an LED chip disposed on the carrier and having at least one electrode;

a first encapsulant provided with a plurality of phosphor particles therein and covering the LED chip, the first encapsulant having at least one opening exposing at least a portion of the at least one electrode;

at least one bonding wire electrically connected between the at least one electrode and the carrier through the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance; and

a second encapsulant covering the LED chip, the first encapsulant and the at least one bonding wire, wherein the at least one opening of the first encapsulant is filled with the second encapsulant.

9. The LED package structure according to claim 8, wherein the LED chip has a bottom surface facing the carrier, a top surface opposite to the bottom surface, and a plurality of side surfaces connected between the top surface and the bottom surface, the at least one electrode is disposed on the top surface, and the first encapsulant is formed on the top surface and the plurality of side surfaces of the LED chip.

10. The LED package structure according to claim 9, wherein the bottom surface of the LED chip is coplanar with a bottom surface of the first encapsulant.

11. The LED package structure according to claim 8, wherein the carrier has a cavity accommodating the LED chip.

12. The LED package structure according to claim 11, wherein the cavity is filled with the second encapsulant, while a top surface of the second encapsulant is coplanar with a top surface of the carrier surrounding the cavity.

13. The LED package structure according to claim 8, wherein the carrier comprises a metal leadframe, a pre-molded metal leadframe or a circuit substrate.

14. The LED package structure according to claim 9, wherein the LED chip has a first electrode and a second electrode both disposed on the top surface of the LED chip, while the first electrode and the second electrode are respectively electrically connected to the carrier via a first bonding wire and a second bonding wire.

15. A light emitting diode (LED) package structure, comprising:

a carrier;

an LED chip disposed on the carrier, the LED chip having opposing top and bottom surfaces and a plurality of side surfaces connected between the top surface and the bottom surface, the LED chip having at least one electrode on the top surface; and

a first encapsulant disposed on the top surface and the side surfaces of the LED chip, the first encapsulant having at least one opening exposing the at least one electrode,

at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance;

a plurality of phosphor particles provided within the first encapsulant; and

a second encapsulant, disposed on the carrier and encapsulating the LED chip, at least a portion of the second encapsulant is formed in the at least one opening of the first encapsulant.

16. The LED package structure according to claim 15, wherein the carrier comprises a metal leadframe, a pre-molded metal leadframe or a circuit substrate.

17. The LED package structure according to claim 15, wherein the LED chip has a first electrode and a second electrode both disposed on the top surface of the LED chip, while the first electrode and the second electrode are respectively electrically connected to the carrier via a first bonding wire and a second bonding wire.