Light emitting package structure
First Claim
1. A light emitting diode (LED) package structure, comprising:
- a carrier;
an LED chip disposed on the carrier, the LED chip having at least one electrode;
a first encapsulant disposed on the carrier and covering the LED chip, the first encapsulant being provided with at least one opening exposing at least a portion of the at least one electrode;
at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance;
a plurality of phosphor particles distributed within the first encapsulant; and
a second encapsulant, disposed on the carrier and encapsulating the LED chip, the first encapsulant and the at least one bonding wire.
1 Assignment
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Accused Products
Abstract
A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire.
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Citations
17 Claims
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1. A light emitting diode (LED) package structure, comprising:
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a carrier; an LED chip disposed on the carrier, the LED chip having at least one electrode; a first encapsulant disposed on the carrier and covering the LED chip, the first encapsulant being provided with at least one opening exposing at least a portion of the at least one electrode; at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance; a plurality of phosphor particles distributed within the first encapsulant; and a second encapsulant, disposed on the carrier and encapsulating the LED chip, the first encapsulant and the at least one bonding wire. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A light emitting diode (LED) package structure, comprising:
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a carrier; an LED chip disposed on the carrier and having at least one electrode; a first encapsulant provided with a plurality of phosphor particles therein and covering the LED chip, the first encapsulant having at least one opening exposing at least a portion of the at least one electrode; at least one bonding wire electrically connected between the at least one electrode and the carrier through the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance; and a second encapsulant covering the LED chip, the first encapsulant and the at least one bonding wire, wherein the at least one opening of the first encapsulant is filled with the second encapsulant. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light emitting diode (LED) package structure, comprising:
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a carrier; an LED chip disposed on the carrier, the LED chip having opposing top and bottom surfaces and a plurality of side surfaces connected between the top surface and the bottom surface, the LED chip having at least one electrode on the top surface; and a first encapsulant disposed on the top surface and the side surfaces of the LED chip, the first encapsulant having at least one opening exposing the at least one electrode, at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance; a plurality of phosphor particles provided within the first encapsulant; and a second encapsulant, disposed on the carrier and encapsulating the LED chip, at least a portion of the second encapsulant is formed in the at least one opening of the first encapsulant. - View Dependent Claims (16, 17)
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Specification