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Light emitting package structure

  • US 8,450,770 B2
  • Filed: 05/11/2010
  • Issued: 05/28/2013
  • Est. Priority Date: 05/11/2010
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) package structure, comprising:

  • a carrier;

    an LED chip disposed on the carrier, the LED chip having at least one electrode;

    a first encapsulant disposed on the carrier and covering the LED chip, the first encapsulant being provided with at least one opening exposing at least a portion of the at least one electrode;

    at least one bonding wire electrically connected between the at least one electrode and the carrier via the at least one opening, wherein the at least one bonding wire is located within the at least one opening and apart from the first encapsulant with a distance;

    a plurality of phosphor particles distributed within the first encapsulant; and

    a second encapsulant, disposed on the carrier and encapsulating the LED chip, the first encapsulant and the at least one bonding wire.

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