Microelectromechanical system package with strain relief bridge

• US 8,450,817 B2
• Filed: 08/14/2008
• Issued: 05/28/2013
• Est. Priority Date: 08/14/2008
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony
• Primary Examiner(s): Huynh, Andy
• Application Number:
  US12/191,857
• Publication Number:
  US 20100038733A1
• Time in Patent Office: 1,748 Days
• Field of Search: 257/414, 257/415, 257/416, 257/419, 257/690, 257/E29.324
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

Claims

1. A MicroElectroMechanical System (MEMS) package comprising:

a MEMS device that includes a diaphragm;

a circuit board; and

a elastically deformable bridge member that is separate from the diaphragm, the bridge member having a first portion and a second portion, the bridge member being coupled to the MEMS device at the first portion and coupled to the circuit board at the second portion, the elastically deformable bridge member at least partially absorbing and dissipating mechanical strain communicated from the circuit board to the elastically deformable bridge member before the mechanical strain can reach the MEMS device.

2. The MEMS package of claim 1 wherein the elastically deformable bridge member comprises:

a first substrate layer;

a second substrate layer; and

a elastically deformable element residing between the first substrate layer and the second substrate layer, the elastically deformable element being coupled to the MEMS device;

a plurality of contact members applied to the first substrate layer and the second substrate layer, the plurality of contact members at least partially surrounding the elastically deformable element, the plurality of contact members being coupled to the circuit board.

3. The MEMS package of claim 1 wherein the MEMS device is a microphone.

4. The MEMS package of claim 1 wherein the circuit board defines a hole and the bridge member at least partially covers the hole.

5. The MEMS package of claim 4 wherein the MEMS device at least partially resides within the hole in the circuit board.

6. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:

a first substrate layer configured to be attachable to a circuit board;

a first elastically deformable element coupled to the first substrate layer, the first elastically deformable element configured to be attachable to a MicroElectroMechanical (MEMS) device; and

wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device;

wherein the MEMS device includes a diaphragm and the first elastically deformable element is separate from the diaphragm.

7. The strain absorption bridge of claim 6 wherein the first substrate layer is ring-shaped and defines a first opening extending to the circuit board.

8. The strain absorption bridge of claim 6 further comprising a housing, the housing being coupled to the first substrate layer.

9. The strain absorption bridge of claim 6 further comprising a housing, the housing being coupled to the first elastically deformable element.

10. The strain absorption bridge of claim 6 further comprising a second elastically deformable element that is arranged to at least partially enclose the MEMS device and the first elastically deformable element.

11. The strain absorption bridge of claim 10 further comprising a second substrate layer that is coupled to the first substrate layer and wherein the second elastically deformable element is supported by the second substrate layer.

12. The strain absorption bridge of claim 6 further comprising a second substrate layer, and wherein the first elastically deformable element is coupled to the first substrate layer and the second substrate layer.

13. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:

a first substrate layer wherein the first substrate layer is configured to be coupled to a MicroElectroMechanical (MEMS) device that includes a diaphragm; and

a first elastically deformable element that is separate from the diaphragm and is coupled to the first substrate layer and which at least partially absorbs and dissipates mechanical strain communicated from a circuit board before the mechanical strain can reach the MEMS device.

14. The strain absorption bridge of claim 13 wherein the first elastically deformable element defines an opening extending to the first substrate layer.

15. The strain absorption bridge of claim 13 wherein the first elastically deformable element is configured to be coupled to the circuit board.

16. The strain absorption bridge of claim 15 further comprising a second elastically deformable element that at least partially encloses the first elastically deformable element.

17. The strain absorption bridge of claim 13 further comprising a housing that is configured to enclose the MEMS device.

18. The strain absorption bridge of claim 13 further comprising a second substrate layer, wherein the first elastically deformable element is configured to be coupled to the second substrate layer.

19. The strain absorption bridge of claim 18 further comprising a second elastically deformable element that at least partially encloses the MEMS device.

20. The strain absorption bridge of claim 19 wherein the second elastically deformable element is coupled to a third substrate layer.

21. The strain absorption bridge of claim 19 wherein the second elastically deformable element is coupled to the first substrate layer.

22. The strain absorption bridge of claim 13 further comprising a housing and wherein the housing is coupled to the first substrate layer and at least partially encloses the MEMS device.