Microelectromechanical system package with strain relief bridge
First Claim
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1. A MicroElectroMechanical System (MEMS) package comprising:
- a MEMS device that includes a diaphragm;
a circuit board; and
a elastically deformable bridge member that is separate from the diaphragm, the bridge member having a first portion and a second portion, the bridge member being coupled to the MEMS device at the first portion and coupled to the circuit board at the second portion, the elastically deformable bridge member at least partially absorbing and dissipating mechanical strain communicated from the circuit board to the elastically deformable bridge member before the mechanical strain can reach the MEMS device.
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Abstract
A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.
22 Citations
22 Claims
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1. A MicroElectroMechanical System (MEMS) package comprising:
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a MEMS device that includes a diaphragm; a circuit board; and a elastically deformable bridge member that is separate from the diaphragm, the bridge member having a first portion and a second portion, the bridge member being coupled to the MEMS device at the first portion and coupled to the circuit board at the second portion, the elastically deformable bridge member at least partially absorbing and dissipating mechanical strain communicated from the circuit board to the elastically deformable bridge member before the mechanical strain can reach the MEMS device. - View Dependent Claims (2, 3, 4, 5)
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6. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
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a first substrate layer configured to be attachable to a circuit board; a first elastically deformable element coupled to the first substrate layer, the first elastically deformable element configured to be attachable to a MicroElectroMechanical (MEMS) device; and wherein the elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device; wherein the MEMS device includes a diaphragm and the first elastically deformable element is separate from the diaphragm. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A strain absorption bridge for use in a MicroElectroMechanical System (MEMS) package comprising:
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a first substrate layer wherein the first substrate layer is configured to be coupled to a MicroElectroMechanical (MEMS) device that includes a diaphragm; and a first elastically deformable element that is separate from the diaphragm and is coupled to the first substrate layer and which at least partially absorbs and dissipates mechanical strain communicated from a circuit board before the mechanical strain can reach the MEMS device. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification