Method and system for communicating via flip-chip die and package waveguides
First Claim
1. A method for wireless communication, the method comprising:
- wirelessly communicating one or more electrical signals between sections of an integrated circuit via one or more electrical waveguides integrated in a multi-layer package, wherein said integrated circuit is bonded to said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package.
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Accused Products
Abstract
Methods and systems for communicating via flip-chip die and package waveguides are disclosed and may include communicating one or more signals between sections of an integrated circuit via one or more waveguides integrated in a multi-layer package. The integrated circuit may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuit or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.
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Citations
18 Claims
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1. A method for wireless communication, the method comprising:
wirelessly communicating one or more electrical signals between sections of an integrated circuit via one or more electrical waveguides integrated in a multi-layer package, wherein said integrated circuit is bonded to said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A system for wireless communication, the system comprising:
one or more circuits in an integrated circuit bonded to a multilayer package, wherein said one or more circuits enables wireless communication of one or more electrical signals between or among sections of said integrated circuit via one or more electrical waveguides integrated in said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
Specification