Method and system for communicating via flip-chip die and package waveguides

• US 8,450,846 B2
• Filed: 08/14/2008
• Issued: 05/28/2013
• Est. Priority Date: 06/19/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US12/191,605
• Publication Number:
  US 20090315637A1
• Time in Patent Office: 1,748 Days
• Field of Search: 257/728, 257/E23.002, 333/105, 333/108
• US Class Current: 257/728
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19032 being a microstrip line type
• CPC Class Codes: H01L 2924/19033 being a coplanar line type
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 3/121 integrated in a substrate
• CPC Class Codes: H01P 5/024 between hollow waveguides

Abstract

Methods and systems for communicating via flip-chip die and package waveguides are disclosed and may include communicating one or more signals between sections of an integrated circuit via one or more waveguides integrated in a multi-layer package. The integrated circuit may be bonded to the multi-layer package. The waveguides may be configured via switches in the integrated circuit or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The waveguides may comprise metal and/or semiconductor layers deposited on and/or embedded within the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

wirelessly communicating one or more electrical signals between sections of an integrated circuit via one or more electrical waveguides integrated in a multi-layer package, wherein said integrated circuit is bonded to said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package.

2. The method according to claim 1, comprising configuring said one or more electrical waveguides via switches integrated within said integrated circuit.

3. The method according to claim 1, comprising configuring said one or more electrical waveguides via MEMS switches integrated in said multi-layer package.

4. The method according to claim 1, wherein said one or more electrical signals comprises a microwave signal.

5. The method according to claim 1, comprising configuring said wireless communication of said one or more electrical signals via a low frequency control signal.

6. The method according to claim 5, wherein said low frequency control signal comprises a digital signal.

7. The method according to claim 1, wherein said one or more electrical waveguides comprise metal layers deposited on said multi-layer package.

8. The method according to claim 1, wherein said one or more electrical waveguides comprise semiconductor layers deposited on said multi-layer package.

9. The method according to claim 1, wherein said one or more electrical waveguides comprise semiconductor layers embedded within said multi-layer package.

10. A system for wireless communication, the system comprising:

one or more circuits in an integrated circuit bonded to a multilayer package, wherein said one or more circuits enables wireless communication of one or more electrical signals between or among sections of said integrated circuit via one or more electrical waveguides integrated in said multi-layer package, wherein said one or more electrical waveguides comprise metal layers embedded within said multi-layer package.

11. The system according to claim 10, wherein said one or more circuits enables configuration of said one or more electrical waveguides via switches integrated within said integrated circuit.

12. The system according to claim 10, wherein said one or more circuits enables configuration of said one or more electrical waveguides via MEMS switches integrated in said multi-layer package.

13. The system according to claim 10, wherein said one or more electrical signals comprises a microwave signal.

14. The system according to claim 10, wherein said one or more circuits enables configuration of said wireless communication of said one or more electrical signals via a low frequency control signal.

15. The system according to claim 14, wherein said low frequency control signal comprises a digital signal.

16. The system according to claim 10, wherein said one or more electrical waveguides comprise metal layers deposited on said multi-layer package.

17. The system according to claim 10, wherein said one or more electrical waveguides comprise semiconductor layers deposited on said multi-layer package.

18. The system according to claim 10, wherein said one or more electrical waveguides comprise semiconductor layers embedded within said multi-layer package.