Package including an underfill material in a portion of an area between the package and a substrate or another package

• US 8,451,620 B2
• Filed: 11/30/2009
• Issued: 05/28/2013
• Est. Priority Date: 11/30/2009
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Yim, Myung Jin, Quevedo, Nanette, Strode, Richard
• Primary Examiner(s): Norris, Jeremy
• Assistant Examiner(s): Willis, Tremesha S
• Application Number:
  US12/627,937
• Publication Number:
  US 20110128711A1
• Time in Patent Office: 1,275 Days
• Field of Search: 361/784, 361/760, 361/782, 361/783, 174/260, 257/528, 257/678, 257/783, 257/789
• US Class Current: 361/784
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49179 : by metal fusion bonding

Abstract

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.

Claims

1. An apparatus comprising:

a substrate or a first package;

a second package coupled to the substrate or the first package, wherein the second package includes at least one die; and

a plurality of solder joints coupling the second package to the substrate or the first package, wherein an underfill material is disposed around a first one of the plurality of solder joints that couples second package to the substrate or the first package, and wherein a second one of the plurality of solder joints that couples the second package to the substrate or the first package has substantially no contact with the underfill material.

2. The apparatus of claim 1, wherein the plurality of solder joints is a first plurality of solder joints, and wherein the apparatus further comprises a third package coupled to the substrate by a second plurality of solder joints.

3. The apparatus of claim 1, wherein the underfill material is disposed between at least one corner of a surface of the second package and the substrate or the first package, and wherein substantially no underfill material is disposed between a center of the surface of the second package and the substrate or the first package.

4. The apparatus of claim 1, wherein the plurality of solder joints are disposed in an area between the second package and the substrate or the first package, wherein the underfill material is disposed in a first portion of the area between the package and the substrate or the first package, and wherein a second portion of the area between the second package and the substrate or the first package is substantially free of the underfill material.

5. The apparatus of claim 1, wherein the underfill material is a no-flow underfill material.

6. The apparatus of claim 1, wherein the underfill material is an epoxy flux material.

7. The apparatus of claim 1, wherein the second package is a chip scale package.

23. The apparatus of claim 1, wherein the plurality of solder joints are disposed directly between the second package and the substrate or the first package.

24. The apparatus of claim 1, wherein the underfill material is in direct contact with the first one of the plurality of solder joints.

25. The apparatus of claim 1, further comprising an encapsulant material encapsulating, at least in part, the second package.

26. The apparatus of claim 1, wherein the underfill material is located only at corners of the substrate or the first package.

27. The apparatus of claim 26, wherein a plurality of regions of the underfill material are at respective corners of the substrate or the first package.

28. The apparatus of claim 27, wherein the regions of the underfill material are spaced apart from one another.

29. The apparatus of claim 1, wherein the second one of the plurality of solder joints electrically couples a pad of the second package to a pad of the substrate or the first package, wherein the underfill material has substantially no contact with the pad of the second package and the pad of the substrate or the first package.

8. A method comprising:

depositing an underfill around a first one of a plurality of solder bumps of a package having a die such that the underfill material has substantially no contact with a second one of the plurality of solder bumps;

placing the package onto a substrate or another package such that plurality of solder bumps and the underfill material is disposed between the package and the substrate or another package; and

heating the underfill material to cure the underfill material to couple the package to the substrate or another package such that the second one of the plurality of solder bumps electrically couples the package to the substrate or another package and has substantially no contact with the underfill material.

9. The method of claim 8, wherein depositing the underfill material comprises depositing the underfill material on at least one corner of a surface of the package, leaving an area between a center of the surface of the second package and the substrate or the first package substantially free of the underfill material.

10. The method of claim 8, wherein depositing the underfill material comprises depositing the underfill material in a first portion of a surface of the package and leaving a second portion of the surface substantially free of the underfill material.

11. The method of claim 8, wherein heating comprises curing the underfill material substantially simultaneously with reflowing the plurality of solder bumps to form a corresponding plurality of solder joints.

12. The method of claim 8, wherein depositing the underfill material comprises screen printing, dispensing, or jetting the underfill material onto the package.

13. The method of claim 8, wherein depositing the underfill material comprises dipping the package into the underfill material.

30. The method of claim 8, further comprising:

electrically coupling the package to the substrate using the second one of the plurality of solder bumps which has substantially no contact with the underfill material.

14. A system comprising:

a substrate including a host logic device bus;

a flash memory device including a package physically coupled to the substrate, wherein the package includes at least one die, wherein a plurality of solder joints couple the package to the substrate, wherein an underfill material is disposed around a first one of the plurality of solder joints, wherein a second one of the plurality of solder joints that couples the package to the substrate has substantially no contact with the underfill material, and wherein the flash memory device is electrically coupled to the host logic device bus; and

a host logic device physically mounted to the substrate, and electrically coupled with the host logic device bus.

15. The system of claim 14, wherein the flash memory device comprises phase change memory device.

16. The system of claim 14, wherein the package is a first package, the plurality of solder joints is a first plurality of solder joints, and the underfill material is a first underfill material, and wherein the flash memory device includes a second package physically coupled to the first package wherein a second plurality of solder joints couple the second package to the first package, wherein a second underfill material is disposed around a first one of the second plurality of solder joints, wherein a second one of the second plurality of solder joints has substantially no contact with the second underfill material.

17. The system of claim 14, wherein the host logic device comprises a plurality of processor cores.

18. The system of claim 14, wherein the system is a selected one of a set-top box, a digital recorder, a game console, a personal digital assistant, a mobile phone, a digital media player, or a digital camera.

31. The system of claim 14, wherein the second one of the plurality of solder joints electrically couples a pad of the package to a pad of the substrate.

19. A method comprising:

depositing an underfill material around a first one of a plurality of solder bumps of a package having a die such that the underfill material has substantially no contact with a second one of the plurality of solder bumps, for subsequent placing of the package onto a substrate or another package such that the second one of the plurality of solder bumps electrically couples the package to the substrate or another package and the underfill material and the plurality of solder bumps are disposed between the package and the substrate or another package; and

distributing the package with an underfill material deposited around the first one of the plurality of solder bumps for placing on the substrate or another package.

20. The method of claim 19, wherein depositing the underfill material comprises depositing the underfill material on at least one corner of a surface of the package, leaving an area between a center of the surface of the package substantially free of the underfill material.

32. The method of claim 19, further comprising coupling the package to the substrate or another package using the second one of the plurality of solder bumps, the underfill material has substantially no contact with the second one of the plurality of solder bumps after coupling the package to the substrate or another package.

21. A method comprising:

placing a package having a die, a plurality of solder bumps, and an underfill material onto a substrate or another package such that the underfill material is disposed between the package and the substrate or another package, wherein the package being placed has been deposited with the underfill material around a first one of the plurality of solder bumps such that the underfill material has substantially no contact with a second one of the plurality of solder bumps that couples the package to the substrate or another package; and

heating the underfill material to cure the underfill material to couple the package to the substrate or another package.

22. The method of claim 21, wherein heating comprises curing the underfill material substantially simultaneously with reflowing the plurality of solder bumps to form a corresponding plurality of solder joints.