Speaker clip

• US 8,452,037 B2
• Filed: 05/05/2010
• Issued: 05/28/2013
• Est. Priority Date: 05/05/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Filson, John Benjamin, Whang, Eugene, Rohrbach, Matthew
• Primary Examiner(s): Ni, Suhan
• Application Number:
  US12/774,395
• Publication Number:
  US 20110274303A1
• Time in Patent Office: 1,119 Days
• Field of Search: 381/306, 381/311, 381333-334, 381/388
• US Class Current: 381/334
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/025 Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
• CPC Class Codes: H04R 1/026 Supports for loudspeaker casings
• CPC Class Codes: H04R 1/028 associated with devices performing functions other than acoustics, e.g. electric candles
• CPC Class Codes: H04R 17/005 using a piezoelectric polymer
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Certain embodiments may take the form of an electronic device having a main housing encapsulating operative circuitry for the device. The electronic device includes an attachment member moveably coupled to the metal housing. The attachment member has an acoustical device located therein that is communicatively coupled to the operative circuitry in the main housing. The attachment member includes a recessed portion for positioning the acoustical device within the attachment member.

Claims

1. An electronic device comprising:

a main housing encapsulating operative circuitry for the device;

an attachment member moveably coupled to the main housing with a spring loaded hinge to maintain the attachment member in a closed position relative to the main housing; and

an acoustical device positioned within the attachment member, the acoustical device communicatively coupled to the operative circuitry in the main housing, wherein the attachment member comprises a recessed portion for positioning the acoustical device within the attachment member;

wherein an adhesive layer is positioned between the piezoelectric speaker and the attachment member and wherein a second adhesive layer is positioned over the piezoelectric speaker and a cover layer is positioned over the second adhesive layer, the second adhesive layer securing the cover layer to the piezoelectric speaker.

2. The device of claim 1 wherein the acoustical device is communicatively coupled to the operative circuitry with a coaxial conduit routed through a hinge block.

3. The device of claim 1, wherein the acoustical device is communicatively coupled to the operative circuitry via a flex microstrip.

4. The device of claim 1 wherein the acoustical device comprises a piezoelectric speaker.

5. The device of claim 4 wherein the recessed portion includes one or more guides to aid in positioning the piezoelectric speaker within the attachment member.

7. The device of claim 1 wherein a surface of the attachment member located over the acoustical device is substantially flat.

6. An electronic device comprising:

a main housing encapsulating operative circuitry for the device;

an attachment member moveably coupled to the main housing with a spring loaded hinge to maintain the attachment member in a closed position relative to the main housing;

an acoustical device positioned within the attachment member, the acoustical device communicatively coupled to the operative circuitry in the main housing, wherein the attachment member comprises a recessed portion for positioning the acoustical device within the attachment member; and

at least one spring plate positioned on one of a surface of a hinge block or the attachment member where a spring member makes contact.

8. The device of claim 6, wherein the acoustical device is communicatively coupled to the operative circuitry with a coaxial conduit routed through the hinge block.

9. The device of claim 6, wherein the acoustical device is communicatively coupled to the operative circuitry via a flex microstrip.

10. The device of claim 6, wherein the acoustical device comprises a piezoelectric speaker.

11. The device of claim 10, wherein the recessed portion includes one or more guides to aid in positioning the piezoelectric speaker within the attachment member.

12. The device of claim 10, wherein an adhesive layer is positioned between the piezoelectric speaker and the attachment member.

13. The device of claim 6, wherein a surface of the attachment member located over the acoustical device is substantially flat.