Optical sensing device for use in a medical device

• US 8,452,402 B2
• Filed: 04/23/2008
• Issued: 05/28/2013
• Est. Priority Date: 04/23/2008
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Ecker, Robert M., Kuhn, Jonathan L., Reinke, James D., Cinbis, Can, Davis, Timothy J., Gerrish, Paul F., Roberts, Jonathan P.
• Primary Examiner(s): Koharski, Christopher D
• Assistant Examiner(s): CAREY, MICHAEL JAMES
• Application Number:
  US12/107,921
• Publication Number:
  US 20090270953A1
• Time in Patent Office: 1,861 Days
• Field of Search: 607/2, 362/267, 362/297, 362/296.04, 250/553, 600/333, 600/310, 600/317, 600/325
• US Class Current: 607/23
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 5/0086 using infrared radiation
• CPC Class Codes: A61N 1/3621 for treating or preventing abnormally high heart rate
• CPC Class Codes: A61N 1/36557 controlled by chemical substances in blood
• CPC Class Codes: A61N 1/3956 Implantable devices for applying electric shocks to the heart, e.g. for cardioversion

Abstract

A reflectance-type optical sensor includes one or more photodiodes formed in a semiconductor substrate. A well having sidewalls and a bottom is formed in the top surface of the substrate, and a reflective layer is formed on the sidewalls and bottom. A light-emitting diode (LED) is mounted in the well, so that light emitted laterally and rearwardly from the LED strikes the sidewalls or bottom and is redirected in a direction generally perpendicular to the top surface of the substrate. The optical sensor can be fabricated using microelectromechanical systems (MEMS) fabrication techniques.

Claims

1. An optical device for an implantable medical device comprising:

a substrate;

a well in the substrate having sidewalls and a bottom surface;

a reflective coating on at least one of the bottom surface and the sidewalls of the well;

a light emitting diode mounted on the flat bottom surface of the well; and

a photodetector in the substrate and configured for receiving light emitted by the light emitting diode,

wherein the substrate comprises an upper substrate portion bonded to a lower substrate portion, the photodetector being in the lower substrate portion.

2. The device of claim 1, wherein the reflective coating comprises an electrically conductive material.

3. The device of claim 2, wherein the reflective coating is connected to a first contact pad.

4. The device of claim 3, wherein the light emitting diode includes a lower electrode connected to the reflective coating.

5. The device of claim 4, wherein the light emitting diode includes an upper electrode electrically connected to a second contact pad.

6. The device of claim 1, wherein the light emitting diode is mounted in the well so that an upper surface of the light emitting diode is located below an upper end of the well.

7. The device of claim 1, wherein the substrate comprises a semiconductor material.

8. The device of claim 1, wherein the substrate includes a first conductivity type region, and wherein the photodetector includes at least one photodiode formed by a region of a second conductivity type in the substrate.

9. The device of claim 8, wherein the photodetector comprises a plurality of photodiodes connected in parallel.

10. The device of claim 7, wherein the semiconductor material comprises silicon.

11. The device of claim 10, wherein the sidewalls of the well are inclined at about 54.7°

.

12. The device of claim 1 and further comprising:

a polymeric material over at least a portion of the substrate.

13. The device of claim 11, wherein the polymeric material fills the well to form an optical element over the light emitting diode.

14. The device of claim 1, wherein the sidewalls of the well are inclined.

15. The device of claim 14, wherein the well has a pyramidal shape.

16. The device of claim 1 and further comprising:

a photodetector positioned adjacent the well.

17. The device of claim 1 and further comprising:

a photodetector positioned at the bottom of the well.

18. The device of claim 1, wherein the upper substrate portion defines the well sidewalls, and the lower substrate portion defines the well bottom surface.

19. An optical sensing device for an implantable medical device comprising:

a substrate having a generally planar top surface;

a plurality of wells extending into the substrate from the top surface, each well having inclined sidewalls and a bottom surface;

a plurality of light emitting diodes, each of the light emitting diodes mounted on the bottom surface of a different one of the wells;

a reflective metal coating on at least one of the bottom surface and the sidewalls of the wells; and

a photodetector in the substrate adjacent the plurality of wells,

wherein the substrate comprises an upper substrate portion bonded to a lower substrate portion, the photodetector being in the lower substrate portion.

20. The device of claim 19, wherein the photodetector comprises a plurality of photodiodes.

21. The device of claim 20, wherein the photodiodes are connected in parallel.

22. The device of claim 20, wherein the photodiodes are formed in the substrate.

23. The device of claim 20 and further comprising contact pads for providing electrical connection to the light emitting diodes and the photodiodes.

24. The device of claim 19, wherein each of the light emitting diodes emits light at a different primary wavelength.

25. The device of claim 19, wherein the reflective metal coating provides an electrical connection to one electrode of each of the light emitting diodes.

26. The device of claim 19, wherein the substrate comprises a semiconductor material.

27. The device of claim 19, wherein an upper surface of each of the light emitting diodes is positioned below the top surface of the substrate.

28. The device of claim 27 and further comprising:

a polymeric material filling the wells.

29. The device of claim 19, wherein each of the wells includes four inclined sidewalls.

30. An implantable medical device comprising:

a housing having a wall with a plurality of windows;

a plurality of optical reflectometers, each reflectometer positioned adjacent to one of the windows and comprising;

a substrate having a generally planar top surface;

a plurality of wells extending into the substrate from the top surface, each well having inclined sidewalls and a bottom surface;

a plurality of light emitting diodes, each of the light emitting diodes mounted on the bottom surface of a different one of the wells;

a reflective metal coating on at least one of the bottom surface and the sidewalls of the wells; and

a photodetector in the substrate adjacent the plurality of wells,

wherein the substrate comprises an upper substrate portion bonded to a lower substrate portion, the photodetector being in the lower substrate portion.

31. The device of claim 30, wherein each of the light emitting diodes emits light at a different primary wavelength.

32. The device of claim 31, wherein each reflectometer includes three light emitting diodes that emit light at an infrared primary wavelength, a near infrared primary wavelength, and a red primary wavelength, respectively.

33. The device of claim 30 and further comprising:

a processor for controlling which of the reflectometers acts as a light source and which of the reflectometers acts as a light detector.

34. The device of claim 33 and further comprising:

a therapy delivery system controlled by the processor.

35. The device of claim 34, wherein the processor controls therapy delivered by the therapy delivery system based at least in part by signals received from the reflectometers.

36. The device of claim 30, wherein the photodetector comprises a plurality of photodiodes.

37. The device of claim 30, wherein the reflective metal coating includes a region on the top surface surrounding the wells.

38. The device of claim 30, wherein the reflective metal coating provides an electrical connection to one electrode of each of the light emitting diodes.

39. The device of claim 30, wherein the substrate comprises a semiconductor material.

40. device of claim 30, wherein an upper surface of each of the light emitting diodes is positioned below the top surface of the substrate.

41. The device of claim 40 and further comprising:

a polymeric material filling the wells.

42. The device of claim 30 and further comprising contact pads for providing electrical connection to the light emitting diodes and the photodetector.